STT Memory Cell Multiferroic Exchange Coupling

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Solution Overview

Problem

As semiconductor memory devices, such as STT RAM cells, shrink in size, they face challenges with increased cell disturb due to current-carrying lines, requiring higher currents for switching, which increases power consumption and thermal profiles, affecting cell integrity and reliability.

Innovation Solution

Incorporating a multiferroic material in contact with the ferromagnetic storage material, allowing magnetic switching via an applied electric field through exchange coupling, reducing the programming current and enhancing data reliability and stability by inducing magnetic torque.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the size of MRAM cells decreases, then the integration density increases, but the cell disturb caused by current carrying lines increases

Engineering Contradiction:
Improvecell sizeVSAvoidcell disturb
Core Design Contradiction:
Area of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the conventional write mechanism that uses external magnetic fields generated by current-carrying lines with a spin-transfer torque mechanism. A spin-polarized current passed through the MTJ directly exerts torque on the free layer magnetic moment, eliminating the need for large external currents and reducing cell disturb to adjacent cells while enabling continued scaling

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Area of moving object

If the width of current carrying lines decreases, then the cell size decreases, but the current required to produce switching fields increases

Engineering Contradiction:
Improveline widthVSAvoidpower consumption
Core Design Contradiction:
Area of moving objectVSUse of energy by moving object

Solution Approach 1:

The patent substitutes the external magnetic field generation method with spin-transfer torque switching. Instead of requiring high currents (e.g., 10 mA) through wide lines to generate switching fields, a spin-polarized current (e.g., 200 microamps) passed through the MTJ directly switches the magnetic moment, dramatically reducing power consumption and enabling narrower lines

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the switching mechanism parameter from external magnetic field induction to spin-transfer torque. This parameter change enables the use of much lower current densities (e.g., reducing from 10 mA to 200 microamps), thereby reducing power consumption and thermal effects while maintaining switching functionality

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the programming current increases, then the magnetic moment switching effectiveness increases, but the thermal profile and energy consumption increase

Engineering Contradiction:
Improveswitching effectivenessVSAvoidthermal profile
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent changes the switching parameter from high current external field generation to low current spin-transfer torque. This parameter change maintains reliable magnetic moment switching while reducing the programming current from 10 mA to approximately 200 microamps, thereby reducing thermal profile and energy consumption

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the high-current external field switching mechanism with spin-transfer torque switching. The spin-polarized current efficiently transfers angular momentum to the free layer, achieving reliable switching at much lower current levels and reducing thermal effects that compromise cell integrity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the programming current density, prevents thermally induced magnetic switching, and enables multi-bit capabilities while minimizing the physical footprint of STT memory cells.

Implementation Method 1

Incorporating a multiferroic material in contact with the ferromagnetic storage material, allowing magnetic switching via an applied electric field through exchange coupling

Methodology Applied
Scientific EffectExchange coupling:

Implementation Method 2

reducing the programming current and enhancing data reliability and stability by inducing magnetic torque

Methodology Applied
Scientific EffectMagnetic torque: Torque

Implementation Method 3

unpolarized conduction electrons passing through a first magnetic material having its magnetic moment oriented in a given direction (e.g. a 'pinned' material) are preferentially polarized by their passage through that material by a quantum mechanical exchange interaction with the polarized bound electrons in the material

Methodology Applied
Scientific EffectQuantum mechanical exchange interaction:

Implementation Method 4

When such a stream of polarized conduction electrons subsequently pass through a second magnetic material (e.g., the 'free' material) whose polarization direction is not fixed in space, the polarized conduction electrons exert a torque on the bound electrons in the magnetic materials which, if sufficient, can reverse the polarization of the bound electrons and, thereby, reverse the magnetic moment of the magnetic material

Methodology Applied
Scientific EffectSpin transfer torque: Torque

Data Source

PatentUS8310868B2Spin torque transfer memory cell structures and methods
Publication Date: 2012.11.13 MICRON TECHNOLOGY INC
  • US8310868B2 patent drawing
  • US8310868B2 patent drawing
  • US8310868B2 patent drawing

AI summary

Spin Torque Transfer (STT) memory cell structures and methods are described herein. One or more STT memory cell structures comprise a STT stack including: a pinned ferromagnetic material in contact with an antiferromagnetic material; a tunneling barrier material positioned between a ferromagnetic storage material and the pinned ferromagnetic material; a multiferroic material in contact with the ferromagnetic storage material; and a first electrode and a second electrode, wherein the antiferromagnetic material, the pinned ferromagnetic material, and the ferromagnetic storage material are located between the first electrode and the second electrode. The STT memory cell structure can include a third electrode and a fourth electrode, wherein at least a first portion of the multiferroic material is located between the third and the fourth electrode.