Stud Bump Electrical Connections for Flip Chip Substrates
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Solution Overview
Problem
Conventional wirebonding techniques for electronic assemblies are inefficient and costly due to complex manufacturing processes and reduced manufacturing yield, while flip chip designs with stud bumps offer direct connections but add additional steps and increase costs.
Innovation Solution
The use of stud bumps, which can be individual or stacked, to electrically couple pads in a flip chip design, allowing for flexible material selection and simpler manufacturing processes by sequentially placing them between pads to create direct and robust connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonding techniques are used for electrical connections, then connections can be established between electronic components, but the manufacturing process becomes complex and manufacturing yield is reduced
Solution Approach 1:
The patent extracts the bonding process from complex wirebonding techniques and replaces it with simpler stud bump formation. The stud bumps are formed directly on the substrate using deposition and reflow processes, eliminating the need for wire bonding operations and associated complexity, thereby improving manufacturing yield while maintaining electrical connection functionality.
Solution Approach 2:
The patent replaces the mechanical wirebonding process with a materials-based stud bump formation process. Instead of mechanically manipulating wires and performing bonding operations, the invention uses deposition and reflow processes to form self-aligning stud bumps that automatically establish electrical connections, significantly reducing manufacturing process complexity and improving yield.
2Strength
If flip chip designs with stud bumps are used, then direct and robust connections are achieved, but additional manufacturing steps are added and costs increase
Solution Approach 1:
The patent merges the formation of electrical connections with the substrate fabrication process itself. Stud bumps are formed as an integrated part of the substrate manufacturing sequence using deposition and reflow steps that combine multiple functions into a unified process flow, eliminating the need for separate bonding operations and reducing overall manufacturing complexity despite achieving robust direct connections.
Solution Approach 2:
The patent changes the physical and chemical parameters of the connection structure by using stud bumps with specific material compositions and geometric profiles formed through controlled deposition and reflow processes. These parameter changes enable direct robust connections while the process integration maintains manufacturing simplicity, avoiding the cost and complexity increases associated with traditional flip chip techniques.
3Productivity
If stud bumps are used to electrically couple pads, then manufacturing yield is improved and connections are simplified, but material selection flexibility must be optimized for bonding performance
Solution Approach 1:
The patent employs composite material structures for stud bumps, using combinations of metals and alloys (such as copper, aluminum, or their alloys) that provide both excellent bonding characteristics and electrical conductivity. These composite material choices optimize both manufacturing yield through improved bonding performance and maintain material selection flexibility to match different pad materials and application requirements.
Data Source
AI summary
An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.