Stud-Protrusion Submounts for Precise Die Attach Bonding
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in achieving uniformity, performance, and reliability due to issues such as deformation, delamination, and shifting of components during the bonding process, which affect the electrical, mechanical, and thermal properties of the semiconductor package.
Innovation Solution
The use of a submount with stud protrusions in the semiconductor package, where the semiconductor die is attached using a die-attach material, providing greater control over the die-attach process and enhancing the reliability and performance of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding processes are used to attach semiconductor die to submount, then the packaging process can be completed, but deformation, delamination, and shifting occur during bonding, reducing manufacturing precision and reliability
Solution Approach 1:
The submount surface is prepared in advance with a recess and stud protrusions before the die attachment process. The recess is formed to accommodate the die-attach material, and the stud protrusions are positioned to provide mechanical interlocking with the semiconductor die, ensuring proper alignment and preventing shifting during bonding.
Solution Approach 2:
The submount surface features localized structural variations: a recess area for die-attach material placement and stud protrusions at specific positions. These localized features concentrate the bonding function at critical points, improving die attachment precision and preventing delamination by creating strong anchor points.
2Manufacturing precision
If die-attach material is applied without structured submount surface, then attachment can be made, but control over tilt, fillet height, and bond line thickness is poor, reducing manufacturing precision
Solution Approach 1:
The recess is pre-formed on the submount surface to define the exact location and volume for die-attach material placement. This preliminary structure ensures that the bond line thickness is controlled by the recess depth rather than relying solely on material application precision, improving manufacturing precision without excessive complexity.
Solution Approach 2:
The stud protrusions modify the physical parameters of the bonding interface by providing elevated contact points. This changes the geometry of the die-attach material distribution, controlling fillet height and bond line thickness through the stud height parameter rather than requiring complex process control.
3Temperature
If conventional flat submount surface is used, then manufacturing process is simple, but thermal resistance is high and performance is reduced
Solution Approach 1:
The submount features localized thermal management structures: the recess concentrates thermal interface material at the die-submount interface, and the stud protrusions create direct thermal pathways. This localized approach improves thermal conduction where most needed without requiring complex thermal management systems throughout the entire submount.
Solution Approach 2:
The recess is pre-formed to accommodate thermal interface material or solder, establishing optimal thermal contact between the semiconductor die and submount before final bonding. This preliminary preparation ensures low thermal resistance is achieved through proper material placement rather than complex post-processing.
Data Source
AI summary
Semiconductor packages are provided. In one example, the semiconductor package includes a submount. The semiconductor package further includes a recess in the submount. The recess includes a bottom surface defining a recess plane. The recess further includes at least one stud protrusion extending from the recess plane. The semiconductor package further includes a semiconductor die on the at least one stud protrusion.