Styrene Block Copolymer Adhesive for Semiconductor Wafer Processing

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Solution Overview

Problem

Conventional film adhesives for semiconductor processing face issues with poor adhesion and residue formation due to insufficient adhesive strength at high temperatures and in high vacuum environments, as well as alkaline resistance challenges during processing steps like through-hole electrode formation.

Innovation Solution

A polymer-based adhesive composition is developed by copolymerizing styrene, (meth)acrylic acid ester with a cyclic structure, alkyl(meth)acrylate, carboxylic acid with an ethylenic double bond, a bifunctional monomer, and a styrene macromonomer, resulting in a polymer with a styrene block segment, enhancing heat resistance, adhesive strength, and alkaline resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional film adhesives are used for semiconductor processing, then the adhesive can be applied and removed, but the adhesive strength becomes insufficient at high temperatures causing poor adhesion and residue formation

Engineering Contradiction:

Improveheat resistanceVSAvoidadhesive strength

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the adhesive by incorporating specific functional groups (carboxylic acid, hydroxyl, amino groups) and using polymer blends with glass fibers, to maintain adhesive strength at elevated temperatures up to 200°C or higher during semiconductor processing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite adhesive formulations combining organic polymers with inorganic fillers like glass fibers, and blends multiple polymer types to achieve both high-temperature stability and strong adhesion to semiconductor substrates

Inventive Principle:

Principle #40Composite materials

2Temperature

If the adhesive is heated to high temperatures for processing, then the adhesive strength should be maintained, but gas generation occurs causing adhesion failure

Engineering Contradiction:

Improvehigh temperature stabilityVSAvoidgas generation

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent modifies the thermal decomposition characteristics of the adhesive by selecting polymers and additives with high thermal stability, adjusting the formulation to minimize gas generation during heating cycles in semiconductor manufacturing processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a flux adhesive that is designed to be removed after serving its temporary protective function during dicing, replacing permanent adhesives and eliminating long-term reliability issues

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If the adhesive provides strong adhesion during processing, then the semiconductor wafer is protected, but the adhesive becomes difficult to remove leaving residue

Engineering Contradiction:

Improveadhesive strengthVSAvoidease of stripping

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent adjusts the chemical composition parameters of the adhesive to include functional groups that provide strong initial adhesion but allow controlled removal, achieving optimal balance between bonding strength and stripability for semiconductor manufacturing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates an adhesive with dynamic bonding characteristics that provide strong adhesion during the dicing process but can be easily removed afterward, adapting its bonding strength to different process stages

Inventive Principle:

Principle #15Dynamics

4Ease of manufacture

If conventional adhesives are used, then the application process is simple, but the adhesives show poor alkaline resistance during processing steps

Engineering Contradiction:

Improveapplication simplicityVSAvoidalkaline resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent modifies the chemical composition of the adhesive by incorporating polymers and functional groups with high alkaline resistance to withstand exposure to alkaline solutions during semiconductor manufacturing while maintaining ease of application

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent formulates composite adhesives combining alkaline-resistant polymers with appropriate additives to provide both chemical stability in alkaline environments and practical applicability in semiconductor manufacturing

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS8148457B2Adhesive composition and film adhesive

Publication Date: 2012.04.03 TOKYO OHKA KOGYO CO LTD

AI summary

Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.