Low Molecular Weight Styrenic Resin for High-Frequency Wiring Boards
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Solution Overview
Problem
Current resin compositions used in electronic devices face challenges in achieving low dielectric properties, high glass transition temperature (Tg), and excellent circuit filling properties, particularly when the content of styrenic thermoplastic elastomer is increased, leading to issues with circuit filling and thermal expansion.
Innovation Solution
A resin composition incorporating a styrenic block copolymer, a radical polymerizable compound, and a free radical compound, specifically selected from certain chemical groups, to enhance low dielectric properties, thermal stability, and circuit filling capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the content of styrenic thermoplastic elastomer is increased to improve low dielectric properties, then dielectric properties are improved, but circuit filling properties deteriorate
Solution Approach 1:
The patent changes the molecular weight parameter of the styrenic thermoplastic elastomer from conventional high molecular weight (10000 or more) to low molecular weight (less than 10000). This parameter change allows the elastomer to maintain excellent low dielectric properties while improving circuit filling properties, as the lower molecular weight reduces viscosity and enhances flowability during circuit formation.
Solution Approach 2:
The patent creates a composite resin composition by combining styrenic thermoplastic elastomer with low molecular weight polyphenylene ether and other components in specific proportions. This composite approach allows the material to simultaneously achieve low dielectric properties from the elastomer and good circuit filling properties through the synergistic effect of the low molecular weight polyphenylene ether and optimized composition ratio.
2Reliability
If the content of styrenic thermoplastic elastomer is increased to improve low dielectric properties, then dielectric properties are improved, but thermal expansion properties worsen
Solution Approach 1:
The patent changes the molecular weight parameter of the styrenic thermoplastic elastomer from high to low, which fundamentally alters the thermal expansion characteristics. The low molecular weight elastomer (less than 10000) provides low dielectric properties while maintaining a balanced coefficient of thermal expansion, avoiding the excessive thermal expansion associated with high molecular weight elastomers.
Solution Approach 2:
The patent develops a composite material system combining low molecular weight styrenic thermoplastic elastomer with low molecular weight polyphenylene ether and other components. This composite structure achieves low dielectric properties from the elastomer while the low molecular weight polyphenylene ether contributes to thermal stability, resulting in a balanced coefficient of thermal expansion suitable for high-frequency wiring board applications.
3Reliability
If high molecular weight styrenic thermoplastic elastomer is used to improve low dielectric properties, then dielectric properties are improved, but film forming ability deteriorates
Solution Approach 1:
The patent changes the molecular weight parameter of the styrenic thermoplastic elastomer from high (10000 or more) to low (less than 10000). This parameter change significantly improves film forming ability by reducing the elastomer's viscosity and enhancing its flow characteristics, while still maintaining excellent low dielectric properties through the optimized low molecular weight composition.
Solution Approach 2:
The patent creates a composite resin composition combining low molecular weight styrenic thermoplastic elastomer with low molecular weight polyphenylene ether and other components. This composite structure enables superior film forming ability through the low viscosity and good flowability of the low molecular weight elastomer, while the low dielectric properties are maintained through the specific composition ratio and the presence of polyphenylene ether.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed resin composition achieves excellent low dielectric properties, a high Tg, and improved circuit filling properties while maintaining low thermal expansion, effectively addressing the limitations of existing materials.
Implementation Method 1
a free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2)
Data Source
AI summary
A resin composition contains a styrenic block copolymer, a radical polymerizable compound, and at least one free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2).