Sub-10 Micron Patterning on 3D Implantable Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for patterning micron-sized features on 3D substrates are limited by the need for multiple steps and harmful chemicals in lithographic techniques, and are unsuitable for non-planar substrates, with screen and ink-jet printing restricted to tens of microns in resolution and requiring custom-made masks.
Innovation Solution
The method involves using a combination of direct ink writing for additive deposition and precise laser ablation for subtractive patterning on 3D substrates, allowing for the creation of features smaller than 10 microns with metals, dielectrics, and polymers, using a rotation system and deposition/ablation systems to form electrodes and conducting leads, and applying a protective coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lithographic techniques are used to pattern micron-sized features, then manufacturing precision is improved, but device complexity and use of harmful chemicals increase
Solution Approach 1:
The patent replaces complex lithographic mechanical systems with a simpler direct ink writing system that uses a computer-controlled pen to deposit materials directly onto 3D substrates, eliminating the need for multiple lithography steps, masks, and harmful chemicals while achieving comparable or better precision
Solution Approach 2:
The invention extracts and eliminates the harmful chemical steps and complex mask-making processes from traditional lithography, retaining only the essential material deposition function through a simplified direct writing approach
2Ease of manufacture
If screen or ink-jet printing is used for patterning, then ease of manufacture is improved, but manufacturing precision deteriorates due to limitation to tens of microns resolution
Solution Approach 1:
The patent replaces screen printing and ink-jet printing mechanisms with a direct ink writing system that uses a computer-controlled pen with precise motion control, enabling sub-10-micron resolution while maintaining the simplicity and material versatility of ink-based deposition
3Ease of manufacture
If traditional printing methods are used on non-planar substrates, then ease of manufacture is maintained, but manufacturing precision deteriorates due to inability to pattern on 3D surfaces
Solution Approach 1:
The patent transitions from 2D planar printing to 3D direct ink writing by introducing a computer-controlled pen that can move in three dimensions and conform to complex substrate geometries, enabling precise feature placement on curved and non-planar surfaces
Solution Approach 2:
The invention introduces dynamic, computer-controlled motion to the deposition system, allowing the pen to adapt its position and orientation in real-time to match the 3D substrate geometry, thereby maintaining precision on complex surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables highly repeatable, accurate, and simple fabrication of implantable devices with features smaller than 10 microns on complex substrates, suitable for biomedical applications such as interfacing with neurons, by allowing precise control over feature size and placement on non-planar surfaces.
Implementation Method 1
precise laser ablation for subtractive patterning on 3D substrates
Implementation Method 2
direct ink writing for additive deposition
Data Source
AI summary
An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.