Sub-Carrier Panel Packaging to Reduce Glass Carrier Warpage
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Solution Overview
Problem
The manufacturing process of fan-out panel-level packages faces challenges in reliability and yield due to warpage and deformation issues caused by differences in thermal expansion coefficients between the glass carrier substrate and insulating layers, leading to defects and reduced efficiency in forming highly integrated electronic devices.
Innovation Solution
The method involves using multiple sub-carriers with different stiffness and thermal expansion coefficients, spaced apart on a carrier substrate, allowing for reduced warpage and enabling the reuse of the carrier substrate for forming new units, with faulty units being lifted off and repaired, and the use of adhesive and optical release materials for efficient attachment and detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a glass carrier substrate is used for FOPLP manufacturing, then high integration and miniaturization are achieved, but warpage and deformation occur due to thermal expansion coefficient differences
Solution Approach 1:
The patent divides the carrier substrate into multiple removable carriers instead of using a single large glass substrate. Each carrier can be independently handled, inspected, and replaced, preventing warpage issues from affecting the entire manufacturing process while maintaining high integration capabilities.
Solution Approach 2:
The patent changes the physical parameters of the carrier system by using multiple smaller carriers with controlled dimensions and materials. This segmentation allows for better thermal management and reduced warpage while maintaining the ability to achieve high integration through precise positioning and assembly.
2Reliability
If multiple sub-carriers are used to reduce warpage, then manufacturing reliability improves, but device complexity increases
Solution Approach 1:
The patent designs multiple carriers with standardized, interchangeable structures that can be used across different manufacturing batches. Each carrier serves multiple functions: supporting working units, facilitating removal and replacement, and enabling inspection. This universality reduces the actual complexity despite the increased number of components.
Solution Approach 2:
The patent implements a carrier lifecycle management system where carriers are removed after use, inspected for defects, and either recovered for reuse or discarded. This approach simplifies the overall system by allowing selective replacement of only the necessary carriers rather than managing a complex permanent structure.
3Reliability
If faulty units are lifted off for repair, then yield improves, but manufacturing time increases
Solution Approach 1:
The patent performs inspection and identification of faulty units before final assembly, allowing for early detection and removal of defective working units. This preliminary action prevents rework later in the process and enables efficient replacement with known-good units, improving overall yield while minimizing time loss.
Solution Approach 2:
The patent implements a recovery system where faulty working units are removed, inspected, and either repaired and returned to service or discarded. Known-good units are maintained in a ready state for quick replacement, reducing the time penalty associated with repair operations and improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces warpage, increases manufacturing flexibility, and improves yield by allowing for the reuse of carrier substrates and precise re-attachment of known good units, enabling the formation of electronic devices with varied connecting structures to meet different product requirements.
Implementation Method 1
an adhesive layer is formed on the glass carrier substrate, and the insulating layer is formed on the adhesive layer
Implementation Method 2
the use of adhesive and optical release materials for efficient attachment and detachment
Data Source
AI summary
The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier, forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.