Sub-Chiller Temperature Control System for Semiconductor Wafer Processing
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Solution Overview
Problem
Conventional temperature control systems for semiconductor wafers face challenges in real-time temperature control due to the distance between the semiconductor wafer processing apparatus and the coolant supply apparatus, leading to increased time lag and difficulty in maintaining precise temperature control.
Innovation Solution
A temperature control system that includes a susceptor with a flow path for a temperature adjusting medium, a temperature measuring unit, a first temperature adjusting unit, and a second temperature adjusting unit disposed between the susceptor and the first unit, allowing for real-time temperature adjustments based on measured data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the coolant supply apparatus is installed away from the semiconductor wafer processing apparatus, then the apparatus can be installed in separate locations, but the time lag in temperature control increases and real-time control becomes difficult
Solution Approach 1:
The coolant supply system is divided into two independent parts: a main coolant supply apparatus located away from the processing apparatus, and a sub-chiller unit integrated into or adjacent to the processing apparatus. This segmentation allows the main apparatus to remain in a centralized location while the sub-unit provides local real-time temperature control.
Solution Approach 2:
The sub-chiller unit acts as an intermediary between the main coolant supply apparatus and the processing apparatus. It receives coolant from the main apparatus and performs final temperature adjustments locally, bridging the gap between centralized coolant supply and distributed temperature control requirements.
2Ease of manufacture
If the coolant supply apparatus is installed away from the semiconductor wafer processing apparatus, then the apparatus can be installed in separate locations, but the temperature control precision deteriorates
Solution Approach 1:
The temperature control function is segmented between the main coolant supply apparatus and the sub-chiller unit. The sub-unit performs final temperature adjustments close to the processing apparatus, ensuring precise temperature control while allowing the main apparatus to be installed in a convenient location.
Solution Approach 2:
Temperature control precision is enhanced by placing the sub-chiller unit locally near the processing apparatus. This local temperature adjustment capability ensures that the coolant temperature is precisely controlled at the point of use, regardless of where the main coolant supply apparatus is installed.
3Reliability
If the coolant circulation volume is increased, then the thermal capacity increases, but the temperature control responsiveness decreases
Solution Approach 1:
The coolant system is segmented into a main circulation loop with large thermal capacity and a sub-loop with small thermal capacity. The sub-loop handles rapid temperature adjustments with minimal coolant volume, while the main loop maintains overall thermal stability, separating the conflicting requirements of thermal capacity and responsiveness.
Solution Approach 2:
The system changes the coolant flow parameters by creating two distinct circulation paths: one with large volume for thermal stability and another with small volume for rapid response. The sub-chiller unit controls a smaller coolant volume that can be quickly heated or cooled, enabling fast temperature adjustments without being constrained by the large thermal mass of the main circulation system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the responsiveness and precision of temperature control, enabling more accurate and timely adjustments to maintain the semiconductor wafer's temperature, thereby improving processing precision and throughput.
Implementation Method 1
a temperature measuring unit, which measures a temperature of the object to be processed held on the top surface of the susceptor
Implementation Method 2
a first temperature adjusting unit which adjusts a temperature of the temperature adjusting medium flowing through the flow path
Implementation Method 3
a second temperature adjusting unit which is disposed between the susceptor and the first temperature adjusting unit, and adjusts a temperature of the temperature adjusting medium based on a result of the measurement of the temperature measuring unit
Implementation Method 4
a temperature of a susceptor is controlled by forming a flow path for a coolant in the susceptor on which a semiconductor wafer that is an object to be processed is held and flowing the coolant into the flow path
Data Source
AI summary
The temperature control system includes: a susceptor which allows an object to be processed to be held on a top surface thereof and includes a flow path, through which a temperature adjusting medium flows, formed therein; a temperature measuring unit which measures a temperature of the object to be processed held on the top surface of the susceptor; a first temperature adjusting unit which adjusts a temperature of the temperature adjusting medium flowing through the flow path; and a second temperature adjusting unit which is disposed between the susceptor and the first temperature adjusting unit, and adjusts a temperature of the temperature adjusting medium based on a result of the measurement of the temperature measuring unit.