Sub Matrix Unit Segmentation for Display Manufacturing Cost Reduction

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Solution Overview

Problem

Conventional passive matrix (PM) display apparatuses are costly due to the large number of conductive lines and drivers required, making them inefficient in terms of manufacturing cost without reducing the size of the display apparatus.

Innovation Solution

The implementation of an active matrix (AM) display apparatus using sub matrix units with thin-film transistors and conductive lines connected to a driving circuit board, where surface mount devices are electrically connected through connecting pads, reducing the need for numerous drivers and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If passive matrix driving method is used to drive LEDs, then the display apparatus can be manufactured, but the manufacturing cost becomes high due to large number of conductive lines and drivers required

Engineering Contradiction:
Improvemanufacturing costVSAvoidnumber of conductive lines and drivers
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The display apparatus is divided into multiple sub-matrix units, each independently driven by its own thin-film transistor circuit. This segmentation reduces the need for extensive external conductive lines and drivers, as each sub-matrix unit operates autonomously with integrated thin-film transistor control, thereby lowering overall device complexity and manufacturing cost

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces conventional driver circuitry with thin-film transistor-based active matrix driving. This substitution eliminates the need for separate driver ICs and reduces conductive line requirements, as the thin-film transistors are directly integrated into the display structure, simplifying the driving system and reducing manufacturing complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If the number of drivers is reduced, then manufacturing cost decreases, but the ability to control large-sized display becomes challenging

Engineering Contradiction:
Improvemanufacturing costVSAvoiddisplay control capability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The display is segmented into multiple sub-matrix units that can be independently controlled. Each sub-matrix unit contains its own thin-film transistor circuitry, enabling distributed control across the entire display area. This segmentation allows large displays to be constructed from multiple manageable units, maintaining control capability while reducing the need for extensive external driver circuits

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a centralized driving architecture to a distributed two-dimensional array of thin-film transistor controls. This dimensional approach allows each pixel or sub-pixel to be independently addressed through row and column scanning of thin-film transistors, enabling large display control without requiring a proportional increase in external drivers

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11158612B2Electronic device
Publication Date: 2021.10.26 PANELSEMI CORP
  • US11158612B2 patent drawing
  • US11158612B2 patent drawing
  • US11158612B2 patent drawing

AI summary

An electronic device comprises at least one sub matrix unit, a driving circuit board, and at least one surface mount device. The sub matrix unit comprises a substrate, thin-film circuits and first connecting pads. The thin-film circuits and the first connecting pads are disposed on the operation face of the substrate. The sub matrix unit defines a loading face and comprises second connecting pads, at least one first conductive line, and at least one second conductive line all together arranged on the loading face. A second height defined between a top of the surface mount device and the loading face of the driving circuit board is no less than a first height defined between an uppermost face of the sub matrix unit and the loading face of the driving circuit board.