Automated Sub-Micron Measurement Target Selection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for measuring critical dimensions in semiconductor fabrication are time-consuming and limited, especially when dealing with the complexity of optical proximity correction and the need for increased measurement density, as they rely on manual selection of measurement targets by experienced engineers and are not efficient for simulating or predicting patterns at reducing wavelengths.
Innovation Solution
A system and method that automatically generate and process a large number of measurement targets, associating target measurement parameters, and utilize an interface and processor to receive design information, select measurement targets based on user-defined criteria, and perform measurements using tools like CD-SEM, thereby increasing measurement efficiency and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual selection of measurement targets by experienced engineers is used, then measurement expertise and target selection quality are improved, but measurement time and productivity are worsened
Solution Approach 1:
The system enables automatic selection of measurement targets through computer-executable instructions that autonomously identify and select optimal measurement locations without human intervention, allowing the system to serve itself in the target selection process while maintaining quality standards
Solution Approach 2:
The system changes the operational parameters from manual engineer judgment to automated algorithmic decision-making, using computational methods to evaluate and select measurement targets based on predefined criteria and objectives, thereby increasing throughput while maintaining selection quality
2Quantity of substance
If a large number of CD measurement targets are measured, then measurement coverage and data quality are improved, but measurement time is worsened
Solution Approach 1:
The system performs preliminary automated selection and prioritization of measurement targets before actual measurement, pre-identifying the most critical targets that provide maximum information value, thereby enabling efficient measurement of a large number of targets without measuring all possible targets equally
Solution Approach 2:
The system segments the large set of measurement targets into priority groups based on their importance and information value, allowing the measurement process to focus on high-priority targets first and progressively move to lower-priority targets, optimizing the balance between measurement quantity and time consumption
3Manufacturing precision
If OPC techniques are applied to improve pattern resolution, then printing accuracy is improved, but measurement complexity and simulation difficulty are worsened
Solution Approach 1:
The system introduces an automated target selection algorithm as an intermediary between the complex OPC process and the measurement process, translating the complex OPC patterns into identifiable measurement targets that can be automatically located and measured without requiring direct human interpretation of the complex patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the number of critical dimension measurements that can be performed in a reasonable time frame, improving the accuracy and efficiency of the fabrication process by automating the selection and processing of measurement targets, which is essential for advanced OPC techniques and pattern printing.
Implementation Method 1
The measurement of critical dimension includes directing a very narrow electron beam towards a measurement target
Data Source
AI summary
The invention provides a method that includes the stages of: (i) receiving design information representative of a portion of an object that includes sub micron measurement targets, (ii) processing the received design information to provide a large number of measurement targets; and (iii) associating target measurement parameters to each of large number of measurement targets.The invention provides a system that includes: (i) an interface for receiving design information representative of a portion of a layer of an object that includes sub micron measurement targets; and (ii) a processor, coupled to the interface, for processing the received design information to provide a large number of measurement targets; and for associating target measurement parameters to each of large number of measurement targets.