Sub-Perforation Substrate Lamination for Thin 3D Package Rigidity
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Solution Overview
Problem
Electronic devices formed using 2.5D or 3D package processes face yield reduction due to substrate damage during perforation and laminating processes due to insufficient rigidity.
Innovation Solution
A manufacturing method involving a carrier with a base layer and temporary adhesive layer, combined with precise lamination techniques to align and laminate sub-perforation substrates, ensuring minimal misalignment and improved rigidity, thereby reducing damage during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sub-substrates are made thin to enable perforation process, then signal transmission path is shortened and performance is improved, but substrate rigidity becomes insufficient causing damage during perforation and lamination
Solution Approach 1:
The substrate is divided into two separate sub-substrates that are processed independently and then laminated together. This segmentation allows each thin sub-substrate to be perforated individually with proper support, maintaining rigidity during processing while achieving the desired thin final structure for short signal paths.
Solution Approach 2:
Perforations are created in each sub-substrate before the lamination process. By performing the perforation action preliminarily on supported substrates, the substrate maintains sufficient rigidity during the critical perforation step, avoiding damage that would occur if perforation attempted on the final thin laminated structure.
2Manufacturing precision
If lamination process is performed on thin sub-substrates, then final substrate thickness is reduced for better performance, but misalignment and damage occur due to insufficient rigidity
Solution Approach 1:
The substrate structure is segmented into multiple sub-substrates that are laminated in sequence. Each sub-substrate maintains sufficient thickness and rigidity during its individual handling and alignment process, enabling precise positioning without damage. The final laminated structure achieves the desired thin profile.
Solution Approach 2:
A carrier substrate serves as an intermediary support during the lamination process. The carrier provides rigid support to the thin sub-substrates during alignment and bonding, preventing misalignment and damage. After lamination, the carrier can be removed, leaving the precisely aligned thin substrate structure.
3Reliability
If perforation process is applied to each sub-substrate individually, then signal transmission path is optimized, but yield reduces due to substrate damage during processing
Solution Approach 1:
The manufacturing process is segmented into distinct stages: perforating first sub-substrate while supported, laminating to second sub-substrate, then perforating the combined structure. This segmentation allows each perforation step to be performed on adequately supported material, preventing damage and improving yield while maintaining the optimized signal path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the yield of electronic devices by minimizing substrate damage and misalignment, leading to improved electrical characteristics and reduced defective rates.
Implementation Method 1
A first laminating step is performed to laminate the base layer to the first sub-perforation substrate through the temporary adhesive layer
Implementation Method 2
When performing the first fitting step, along a normal direction of the platform, the carrier moves from a first position to a second position, and a distance between the first position and the platform is greater than a distance between the second position and the platform
Implementation Method 3
A second sub-perforation substrate is provided, and the second sub-perforation substrate is laminated to the first sub-perforation substrate
Data Source
AI summary
A manufacturing method of an electronic device including the following steps is provided. A carrier is provided, wherein the carrier has a base layer and a temporary adhesive layer disposed on the base layer. A first sub-perforation substrate disposed on a platform is provided. A first laminating step is performed to laminate the base layer to the first sub-perforation substrate through the temporary adhesive layer to form a substrate structure. A second sub-perforation substrate is provided, and the second sub-perforation substrate is laminated to the first sub-perforation substrate. When performing the first laminating step, position along a normal direction of the platform, the carrier moves from a first position to a second position, and a distance between the first position and the platform is greater than a distance between the second position and the platform. The electronic device is also provided.