Sub-Reflector Plate Layout for RTP Pyrometer Accuracy and Heating
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Solution Overview
Problem
Current reflector plates for rapid thermal processing (RTP) are costly due to mismatched reflectivity optimization and require complex multi-layer coatings for energy savings and improved heating performance, with only a small portion being used for pyrometer measurement.
Innovation Solution
The use of sub-reflector plates embedded within a base reflector plate, each optimized for pyrometer wavelength, allowing independent functionality and optimization, enabling cost-effective manufacturing and multi-purpose use while maintaining radiation enhancement without affecting wafer radiation reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the reflector plate is manufactured to optimize 100% reflectivity in the pyrometer waveband, then the pyrometer measurement accuracy is improved, but the manufacturing cost increases unnecessarily
Solution Approach 1:
The reflector plate is divided into different regions with different reflectivity characteristics. The first region (pyrometer region) has high reflectivity in the pyrometer waveband for accurate temperature measurement, while the second region (heating region) has different reflectivity properties optimized for heating performance. This local differentiation allows each region to be optimized for its specific function without requiring the entire plate to have uniform high-cost coatings.
2Loss of energy
If complex multi-layer coatings are applied to the reflector plate, then energy savings and heating performance are improved, but the manufacturing cost increases
Solution Approach 1:
Different regions of the reflector plate are assigned different coating configurations. The first region receives coatings optimized for pyrometer reflectivity, while the second region receives coatings optimized for heating performance and energy efficiency. This selective coating approach achieves energy savings and improved heating performance without applying complex multi-layer coatings to the entire plate, thereby reducing manufacturing costs.
3Productivity
If the reflector plate area is increased to improve heating performance, then the wafer heating efficiency is improved, but the device complexity and cost increase
Solution Approach 1:
The reflector plate is segmented into multiple functional regions (first region for pyrometer measurement, second region for heating) with distinct optical and thermal properties. This segmentation allows the plate to achieve improved heating performance through the second region while maintaining measurement accuracy through the first region, without requiring a single large complex structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces costs by optimizing reflectivity for both pyrometer and wafer radiation, enabling efficient temperature control and wavelength management across the substrate, while allowing for substitution of sub-reflector plates for different processes, thus improving heating performance and energy efficiency.
Implementation Method 1
thermal radiation is used to rapidly heat a substrate
Implementation Method 2
reflector plates should, e.g., reflect the whole bandwidth of wafer radiation
Implementation Method 3
reflector plates used for RTP processing of a substrate utilize pyrometers for wafer temperature measurement
Data Source
AI summary
Embodiments of the present disclosure generally relate to apparatus for processing a substrate, and more specifically to reflector plates for rapid thermal processing. In an embodiment, a reflector plate assembly for processing a substrate is provided. The reflector plate assembly includes a reflector plate body, a plurality of sub-reflector plates disposed within the reflector plate body, and a plurality of pyrometers. A pyrometer of the plurality of pyrometers is coupled to an opening formed in a sub-reflector plate. Chambers including a reflector plate assembly are also described herein.