Subcutaneous Implant Delivery Apparatus for AVF Positioning
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Solution Overview
Problem
Current methods for maintaining the health of arteriovenous fistulas (AVFs) during the 'Wear & Tear' phase are inadequate, leading to preventable complications due to poor cannulation and lack of innovative solutions for preserving AVF health, which is critical for reducing the high costs and complications associated with hemodialysis vascular access.
Innovation Solution
A subcutaneous implant delivery apparatus that includes a receiving portion and a stabilizing portion, allowing for the precise placement and anchoring of a subcutaneous implantable device under the skin near an AVF, ensuring accurate positioning and orientation without causing damage to the vascular site, using a mechanism that allows for easy insertion and secure suturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a subcutaneous implantable device is inserted under the skin layer, then the device can be positioned subcutaneously to access vascular sites, but the device may move or shift from the desired position, leading to poor cannulation and AVF complications
Solution Approach 1:
The receiving portion and stabilizing portion are pre-configured to work together as a delivery system. The stabilizing portion is prepared in advance to engage with the receiving portion, ensuring that when the device is deployed, the stabilizing portion can immediately secure the implantable device in the correct position without requiring additional positioning steps during the procedure.
Solution Approach 2:
The receiving portion acts as an intermediary between the implantable device and the stabilizing portion. It temporarily holds the device during insertion and facilitates its transfer to the stabilizing portion, which then secures the device in the final position. This intermediary mechanism ensures precise positioning while preventing device movement.
2Manufacturing precision
If the receiving portion is inserted under the skin layer to position the device subcutaneously, then the device can be placed correctly, but the insertion process becomes complex and difficult to control
Solution Approach 1:
The receiving portion and stabilizing portion are combined into a single integrated delivery apparatus. This merging allows the system to perform multiple functions (holding the device, inserting under the skin, and stabilizing the implant) through a unified structure, reducing the number of separate components and simplifying the overall implantation process while maintaining precision.
3Measurement precision
If the device is held firmly in position during insertion, then positioning accuracy is improved, but the device is difficult to release and deploy
Solution Approach 1:
The connection between the receiving portion and stabilizing portion is designed to be dynamic rather than static. It provides strong holding force during insertion and positioning, then allows for easy release through a simple triggering mechanism. This dynamic characteristic enables the system to transition from a secured state to a deployed state without complexity.
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3D
AI summary
According to embodiments of the present invention, a subcutaneous implant delivery apparatus is provided. The apparatus includes a receiving portion configured to receive a subcutaneous implantable device; and a stabilizing portion configured to cooperate with the receiving portion to hold the subcutaneous implantable device in a fixed position. The receiving portion and the stabilizing portion are movable relative to each other between a released configuration, wherein the receiving portion and the stabilizing portion are configured to move apart from each other to allow the receiving portion to be inserted under a skin layer, and a closed configuration, wherein the receiving portion and the stabilizing portion are configured to move toward each other to allow the subcutaneous implantable device to be held adjacent to the skin layer. According to further embodiments of the present invention, a method of delivering a subcutaneous implantable device for accessing a vascular site is also provided.