Sublimable Drying Composition for Fine Pattern Collapse Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for drying semiconductor substrates with fine uneven patterns face issues of pattern deformation and collapsing due to stress from surface tension, particularly with high aspect ratios, and coagulation at supply nozzle tips, leading to inefficiencies and prolonged coagulation times.
Innovation Solution
A composition comprising a sublimable substance dissolved in a solvent with a boiling point lower than the sublimable substance by 5°C or more and 75°C or lower is used, along with a method involving solvent drying and sublimation to coagulate the substance, using specific fluoroalkanes, fluorocycloalkanes, and other compounds to suppress pattern collapsing and reduce coagulation time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a sublimable substance is used to dry the uneven pattern, then the drying effect is improved, but coagulation occurs at the supply nozzle tip portion
Solution Approach 1:
A surfactant is introduced as an intermediary substance between the sublimable substance and the nozzle tip. The surfactant reduces surface tension and prevents coagulation of the sublimable substance at the nozzle tip, allowing smooth flow and delivery to the substrate without clogging or deposition issues
Solution Approach 2:
The composition parameters are optimized by controlling the concentration of the sublimable substance within 1-80 mass% and the surfactant within 0.1-50 mass%. This parameter control ensures the mixture remains fluid and prevents premature coagulation while maintaining effective drying capability
2Manufacturing precision
If the remaining liquid is replaced with a treatment liquid including a sublimable substance, then the drying performance is improved, but the coagulation time is prolonged
Solution Approach 1:
The coagulation time is reduced by optimizing the concentration parameters: sublimable substance at 1-80 mass% and surfactant at 0.1-50 mass%. This parameter optimization balances fluidity during transport with controlled coagulation speed on the substrate, achieving both fast processing and effective drying
Solution Approach 2:
The surfactant acts as a mediator that delays premature coagulation during liquid state transport, then allows controlled coagulation on the substrate. This enables the treatment liquid to reach the target area quickly without coagulating in transit, reducing overall processing time
3Manufacturing precision
If a sublimable substance is used to dry the uneven pattern, then the drying capability is improved, but pattern collapsing occurs due to surface tension stress
Solution Approach 1:
The surfactant serves as a protective intermediary that reduces surface tension when the treatment liquid contacts the uneven pattern. This surface tension reduction prevents the stress-induced collapsing of fine patterns during the drying process, while still allowing the sublimable substance to effectively remove remaining liquid
Solution Approach 2:
The surfactant concentration (0.1-50 mass%) is controlled to achieve optimal surface tension reduction. This parameter control ensures sufficient protection against pattern collapsing while maintaining the sublimable substance's drying effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents nozzle tip coagulation, reduces coagulation time, and suppresses pattern collapsing, especially for high aspect ratio patterns, while maintaining efficient drying at room temperature and pressure.
Implementation Method 1
drying the solvent in the solution to precipitate a solid sublimable substance
Implementation Method 2
sublimating the coagulated body
Data Source
Figure 1A~1C
AI summary
The composition for drying an uneven pattern of the present invention includes a sublimable substance, and a solvent whose boiling point at 1 atm is lower than a boiling point or a sublimation point of the sublimable substance by 5°C or more and whose boiling point at 1 atm is 75°C or lower.