Sublimable Treatment Liquid for Pattern-Safe Substrate Drying
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Solution Overview
Problem
Current substrate treating methods often fail to adequately dry substrates, leading to pattern collapse, especially when the patterns are fine, as they insufficiently suppress the collapse of the pattern formed on the substrate.
Innovation Solution
A substrate treating method involving a treatment liquid supply step, a solidified film forming step, and a sublimation step, where the treatment liquid contains a sublimable substance with a maximum positive partial charge of 0.22 or more and less than 0.34, forming a solidified film that effectively sublimates to dry the substrate while protecting the pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate treating methods are used for drying substrates, then the drying process is completed, but the pattern formed on the substrate collapses
Solution Approach 1:
The invention changes the chemical parameter of the sublimable substance by specifying a maximum positive partial charge range of 0.22 or more and less than 0.34. This parameter optimization ensures the substance forms a solidified film that sublimates effectively without causing pattern collapse, resolving the contradiction between drying effectiveness and pattern integrity
Solution Approach 2:
The invention utilizes the phase transition of the sublimable substance from solid to gas (sublimation) to dry the substrate. The substance first forms a solidified film on the substrate, then sublimates completely, achieving effective drying while the controlled phase transition prevents pattern collapse
2Manufacturing precision
If the pattern is made fine to increase precision, then the substrate treatment quality improves, but the pattern becomes more susceptible to collapse during drying
Solution Approach 1:
The sublimable substance acts as an intermediary between the solvent and the pattern. It forms a solidified film that provides support during drying, and its specific partial charge range ensures it sublimates without disturbing fine patterns, allowing high-precision patterns to be dried successfully
Solution Approach 2:
By optimizing the maximum positive partial charge of the sublimable substance to 0.22 or more and less than 0.34, the invention creates ideal interaction forces that protect fine patterns during drying while maintaining effective drying capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures appropriate drying of substrates while preventing pattern collapse, maintaining high treatment quality by forming a suitable solidified film that appropriately sublimates, thus effectively protecting the pattern formed on the substrate.
Implementation Method 1
a solidified film forming step of forming a solidified film containing the sublimable substance on the substrate by evaporating the solvent from the treatment liquid on the substrate
Implementation Method 2
a sublimation step of sublimating the solidified film... The solidified film changes to gas without being a liquid
Data Source
AI summary
The present invention relates to a substrate treating method, a substrate treating apparatus, a treatment liquid, and a treatment liquid evaluation method. The substrate treating method includes a treatment liquid supply step, a solidified film forming step, and a sublimation step. In the treatment liquid supply step, the treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance and a solvent. In the solidified film forming step, the solvent evaporates from the treatment liquid on the substrate. In the solidified film forming step, a solidified film is formed on the substrate. The solidified film contains the sublimable substance. In the sublimation step, the solidified film sublimates. The substrate is dried by sublimation of the solidified film. Here, the sublimable substance has a maximum positive partial charge of 0.22 or more and less than 0.34.