Sublimating Release Layer for Clean Alkali Metal Film Transfer
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Solution Overview
Problem
Conventional methods for transferring thin film lithium in energy storage devices suffer from low throughput and challenges in depositing lithium of different sizes over substrates, often resulting in residual release layers that impede ion or electronic transport.
Innovation Solution
A method using a release layer with a low sublimation point, such as hexo-Fluro-isopropoxide (LiHFIP) or lithium Nona-Fluoro-Tertbutoxide (LiNFTB), is employed to transfer lithium from a polymer substrate to a carrier substrate via sublimation, allowing for clean transfer and patterning of the alkali metal layer without residual release layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional release layers are used to transfer thin film lithium, then the transfer process can be completed, but residual release layer material remains and impedes ion or electronic transport
Solution Approach 1:
The patent employs a release layer material that undergoes phase transition from solid to gas (sublimation) when exposed to specific wavelength light. This phase transition allows the release layer to completely evaporate after transferring the lithium film, eliminating residual material that would otherwise impede ion or electronic transport in the energy storage device.
Solution Approach 2:
The patent replaces conventional thermal heating methods with optical irradiation using specific wavelength light sources. This substitution allows for more precise and complete sublimation of the release layer material, ensuring complete removal without leaving residues that would affect device performance.
2Productivity
If conventional roll-to-roll processing is used, then lithium transfer can be achieved, but throughput is low and depositing lithium of different sizes is challenging
Solution Approach 1:
The patent employs a flexible substrate that can be dynamically shaped or folded into different configurations before the lithium deposition and transfer process. This flexibility allows the same continuous roll-to-roll processing system to accommodate lithium films of different sizes and shapes without requiring complex reconfiguration of the processing equipment, thereby maintaining high throughput while enabling size customization.
Solution Approach 2:
The patent divides the lithium transfer process into distinct sequential steps: (1) depositing lithium on the flexible substrate, (2) folding or shaping the substrate into the desired configuration, (3) transferring the lithium to the final destination, and (4) releasing the lithium. This segmentation allows for flexible size customization at the folding step while maintaining efficient continuous processing through the other steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables efficient, high-throughput transfer of lithium with minimal residual material, improving the quality of the alkali metal layer and enabling customization of sizes and patterns suitable for energy storage devices.
Implementation Method 1
the release layer including a low sublimation point, wherein the low sublimation point is less than 120° C., sublimating the release layer via a treatment source to transfer the alkali metal layer
Implementation Method 2
sublimating the release layer via a treatment source to transfer the alkali metal layer from the flexible substrate to the first flexible carrier
Data Source
AI summary
Embodiments of the present disclosure relate to methods and devices related to thin film alkali metal energy storage devices. The method for transferring an alkali metal layer includes disposing a release layer over a flexible substrate, the release layer including a low sublimation point, wherein the low sublimation point is less than 120° C., disposing the alkali metal layer onto the release layer, laminating the release layer and the alkali metal layer between the flexible substrate and a first flexible carrier, sublimating the release layer via a treatment source to transfer the alkali metal layer from the flexible substrate to the first flexible carrier, the treatment source operable to pattern the alkali metal layer, and peeling away the flexible substrate from the first flexible carrier.


