Sublimation Drying of Uneven Substrates Without Dew Condensation
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Solution Overview
Problem
The sublimation drying method for semiconductor structures faces instability in suppressing pattern collapse due to moisture absorption and dew condensation on the film surface, leading to coagulation defects and inconsistent results.
Innovation Solution
Controlling the dew point temperature of the atmosphere in the chamber to be lower than the minimum surface temperature of the film during the coagulation process, ensuring a temperature difference of at least 20°C, and using a sublimable film formation composition with specific solvent properties to prevent moisture absorption and promote stable film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sublimation drying method is used to suppress pattern collapse, then pattern collapse suppression is improved, but stability and reproducibility deteriorate due to moisture absorption and dew condensation
Solution Approach 1:
The patent applies the inert atmosphere principle by controlling the chamber atmosphere to maintain dew point temperature below the film surface temperature, effectively creating a moisture-free environment that prevents dew condensation and moisture absorption during sublimation drying, thereby stabilizing pattern collapse suppression
Solution Approach 2:
The patent applies parameter changes by precisely controlling temperature parameters - specifically maintaining the dew point temperature of the chamber atmosphere below the minimum surface temperature of the film during coagulation, and controlling the temperature difference to be at least 20°C, which stabilizes the sublimation drying process and prevents moisture-related defects
2Quantity of substance
If dew point temperature is high, then moisture absorption and dew condensation occur on film surface, but this leads to coagulation defects and inconsistent results
Solution Approach 1:
The patent creates a controlled atmosphere environment by maintaining dew point temperature below film surface temperature, effectively excluding moisture from the film formation process and preventing coagulation defects
Solution Approach 2:
The patent implements feedback control by monitoring and adjusting the dew point temperature of the chamber atmosphere to ensure it remains below the film surface temperature, with the temperature difference maintained at least 20°C, thereby preventing moisture absorption and ensuring consistent film formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes pattern collapse suppression by reducing moisture absorption and dew condensation, enhancing reproducibility and effectiveness in preventing pattern collapse during the sublimation drying process.
Implementation Method 1
a sublimable substance removal step of removing the sublimable substance from the substrate by heating the substrate to a temperature higher than the sublimation temperature of the sublimable substance
Implementation Method 2
When the dew point temperature of the atmosphere is high, it is presumed that, in the coating film surface, the moisture included in the atmosphere will be absorbed on the entire surface of the coating film or locally, or that the moisture will condense on the entire surface of the coating film or locally
Data Source
AI summary
The method for producing a substrate of the present invention includes a preparation step of preparing a substrate that has an uneven structure at the surface thereof, an arrangement step of arranging the substrate in a chamber with a cleaning liquid held in at least recessed portions of the uneven structure, a supply step of supplying a sublimable substance in a liquid state or supplying a sublimable film formation composition in a liquid state that includes a sublimable substance to at least the recessed portions of the substrate arranged in the chamber, and a sublimation drying step of coagulating, sublimating, and thereby removing a film of the sublimable substance or sublimable film formation composition that has been supplied, the sublimation drying step is controlled such that Tdp and Tmin satisfy Tmin>Tdp.