Sublimation Drying Liquid for Weak Pattern Collapse Prevention
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Solution Overview
Problem
Existing sublimation drying methods fail to adequately prevent pattern collapse on substrates with low mechanical strength, despite using conventional sublimable substances.
Innovation Solution
A substrate treating method and apparatus utilizing a substrate treating liquid containing 2,5-dimethyl-2,5-hexanediol and 3-trifluoromethylbenzoic acid as sublimable substances, which are supplied to the substrate, evaporated to form a solidified film, and then sublimated to remove, effectively preventing pattern collapse by controlling the film thickness and evaporation rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the mechanical strength of the pattern is noticeably small, then the pattern is more delicate and requires gentler treatment, but conventional sublimation drying cannot sufficiently prevent collapse
Solution Approach 1:
The substrate treating liquid acts as an intermediary substance between the drying process and the delicate pattern. The specific sublimable substances (2,5-dimethyl-2,5-hexanediol and 3-trifluoromethylbenzoic acid) serve as mediators that provide mechanical support to weak patterns during drying, enabling collapse prevention without requiring direct mechanical intervention that could damage the delicate structures.
2Manufacturing precision
If a solidified film is formed to prevent pattern collapse, then the film thickness must be controlled, but improper thickness can cause either insufficient protection or excessive residue
Solution Approach 1:
The invention optimizes parameters including sublimable substance concentration (0.1-10 wt%), solvent type, and evaporation conditions to achieve precise film thickness control. By changing these parameters, the process achieves optimal balance where the solidified film is thick enough to prevent collapse but thin enough to sublime completely without residue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses pattern collapse on substrates with low mechanical strength by optimizing the film thickness and evaporation process, enhancing the reliability of sublimation drying.
Implementation Method 1
a solidification process of evaporating the solvent in a liquid film of the substrate treating liquid supplied to the pattern-formed surface in the supply process, depositing the sublimable substance, and forming a solidified film containing the sublimable substance
Implementation Method 2
a sublimation process of sublimating the solidified film and removing the solidified film
Data Source
AI summary
A substrate treating method according to the present invention is a substrate treating method for treating a pattern-formed surface of a substrate W, the substrate treating method including: a supply process of supplying a substrate treating liquid containing a sublimable substance and a solvent to the pattern-formed surface; a solidification process of evaporating the solvent in a liquid film of the substrate treating liquid supplied to the pattern-formed surface in the supply process, depositing the sublimable substance, and forming a solidified film containing the sublimable substance; and a sublimation process of sublimating the solidified film and removing the solidified film, in which the sublimable substance contains at least one of 2,5-dimethyl-2,5-hexanediol and 3-trifluoromethylbenzoic acid.