Submerged Dielectric Fluid Cooling for Electronic Packages
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Solution Overview
Problem
Conventional electronic cooling methods do not provide optimal heat dissipation, leading to excessive heat build-up and potential electrical circuit failure in electronic packages, resulting in large package sizes and reduced power constraints.
Innovation Solution
An electronic package with submersed fluid cooling, featuring a sealed thermally conductive housing containing dielectric fluid in contact with electronic devices and a fluid circulator, such as a piezo fan, to circulate the fluid and enhance heat transfer from the devices to the housing and then to the ambient environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation techniques (heat sinks, air cooled fans) are used, then thermal energy is dissipated away from the electronic device, but the package size becomes large and power constraints are reduced
Solution Approach 1:
The patent employs a liquid cooling system where a dielectric fluid circulates through channels in the substrate to absorb heat from electronic devices. The fluid is pumped through the substrate and dissipates heat through cooling fins, replacing conventional air-based heat sinks with a hydraulic cooling mechanism that achieves superior heat transfer efficiency in a compact form factor
Solution Approach 2:
The cooling channels are integrated directly into the substrate structure, with fluid flow paths embedded within the substrate itself. The electronic devices are mounted on the substrate with thermal contact to the fluid channels, creating a nested configuration where the cooling system is contained within the package structure rather than adding external volume
2Temperature
If conventional heat dissipation techniques are used, then thermal energy is dissipated, but the package complexity increases and cooling efficiency is suboptimal
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides electrical interconnections for electronic devices, contains integrated fluid flow channels for cooling, and acts as a thermal pathway from devices to cooling fins. This merging of electrical, fluidic, and thermal management functions into a single component reduces overall package complexity while improving cooling efficiency
Solution Approach 2:
The dielectric fluid serves dual purposes: it acts as a cooling medium that absorbs and transports heat, and simultaneously provides electrical insulation between the fluid-cooled substrate and other electrical components. This multi-functionality reduces the need for separate insulation components and simplifies the overall system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates thermal energy in a compact design, reducing operating temperatures and enabling more electronics or higher current devices without adverse temperature issues.
Implementation Method 1
a fluid located in the housing in heat transfer relationship with the electronic device
Implementation Method 2
The electronic package also includes a fluid circulator located in the housing in contact with the fluid for circulating the fluid to cool the electronic device
Data Source
AI summary
An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.