Submersion-Cooled Rack Cases for High-Heat Server Arrays
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Solution Overview
Problem
Current cooling systems for electronic devices are inadequate in managing the increasing heat generated by high-performance components, leading to reduced component lifespan and potential data processing errors, despite efforts to reduce waste heat.
Innovation Solution
A liquid submersion-cooled system using dielectric cooling liquids to directly contact and dissipate heat from electronic components, with a scalable architecture that allows for arrays of computers with multiple processor cores, and a thermal dissipation/recovery system that includes external heat exchangers and pumps to efficiently manage heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling or closed-loop liquid cooling systems are used, then the cooling system structure is simpler, but the cooling efficiency is insufficient to manage increasing heat from high-performance components
Solution Approach 1:
The patent employs direct liquid submersion cooling where dielectric liquid directly contacts electronic components to transfer heat efficiently. This hydraulic approach replaces conventional air cooling and closed-loop liquid cooling, achieving superior heat dissipation that maintains components at lower operating temperatures and extends their lifespan while ensuring data processing reliability.
Solution Approach 2:
The system utilizes phase transition of the dielectric liquid through external heat exchangers where the liquid absorbs heat from components, undergoes phase change, and then returns to liquid state after heat rejection. This phase transition mechanism enables highly efficient heat management that conventional cooling methods cannot achieve.
2Reliability
If direct liquid submersion cooling is implemented, then cooling efficiency and component lifespan are improved, but the system complexity and fire safety concerns increase
Solution Approach 1:
The patent employs dielectric liquid that creates an inert, non-conductive environment around electronic components. This dielectric liquid prevents electrical conductivity and fire hazards while enabling direct thermal contact for efficient cooling. The inert nature of the dielectric liquid eliminates fire risk despite direct submersion of live electronics, allowing the system to achieve extended component lifespan without safety compromises.
3Loss of energy
If conventional cooling systems are used, then the system structure is simpler, but heat dissipation capacity is insufficient for high-performance computing
Solution Approach 1:
The patent implements a hydraulic cooling system where dielectric liquid circulates directly through and around electronic components, maximizing thermal contact area. This direct liquid cooling approach achieves superior waste heat removal efficiency compared to air cooling or indirect liquid cooling, efficiently managing the high heat loads of performance computing systems despite increased structural complexity.
Solution Approach 2:
The system merges the cooling function with the structural design by integrating heat exchangers, pumps, and fluid circulation pathways into the overall system architecture. This consolidation approach manages waste heat effectively while organizing the complexity of the liquid cooling system into a unified, manageable structure that handles high-performance computing thermal loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively extends the lifespan of electronic components, minimizes the risk of fires, and reduces operational temperatures, thereby enhancing the reliability and efficiency of high-performance computing systems.
Implementation Method 1
A dielectric cooling liquid is contained in the interior space, and a heat-generating electronic component is disposed within the space and is submerged in the dielectric cooling liquid
Implementation Method 2
the fluid is typically allowed to flow through the active components and then it is pumped to external heat exchangers where the fluid is cooled
Implementation Method 3
it is pumped to external heat exchangers where the fluid is cooled before being returned to the main chamber
Implementation Method 4
external heat exchangers where the fluid is cooled
Data Source
AI summary
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.