Power Component Submount Burr Prevention via Electroplating
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Solution Overview
Problem
Conventional power component submounts face issues with burr formation due to the need for tie bars to connect conductors, which are then sliced, leading to burr creation.
Innovation Solution
A manufacturing method for a power component submount that includes a sputtering step, patterning, electroplating, removing, and electroless plating steps, allowing for the independent formation of conductive structures without tie bars, thereby preventing burr formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If tie bars are used to connect conductors and then sliced to separate them, then conductors can be connected and separated, but burrs are formed on the power component submount
Solution Approach 1:
The patent removes the tie bar component entirely from the manufacturing process. Instead of using tie bars to connect conductors and then slicing them apart, the invention directly forms separate conductors through electroplating on a ceramic substrate, extracting the problematic tie bar element that causes burr formation.
Solution Approach 2:
The patent replaces the mechanical slicing process with an electrochemical electroplating process. Instead of mechanically slicing tie bars to separate conductors, the invention uses electroplating to directly form conductive structures on the substrate, eliminating the need for mechanical cutting that generates burrs.
2Object-generated harmful factors
If electroplating is used to form conductors, then conductors can be formed without tie bars, but additional processing steps are required
Solution Approach 1:
The patent combines multiple functions into the electroplating process itself. The electroplating step simultaneously forms the conductive structures, creates the necessary connections to the substrate, and eliminates the need for separate tie bar formation and slicing operations, merging what were previously separate steps into one integrated process.
Solution Approach 2:
The patent performs preliminary preparation of the ceramic substrate surface before electroplating to ensure proper adhesion and conductor formation. This preliminary action includes surface treatment and pattern formation that enables the electroplating process to directly create the final conductor structures without requiring subsequent processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents burr formation on the power component submount by allowing the conductive structure and electroless plating layers to be independently formed without tie bars, enhancing the assembly process for power components.
Implementation Method 1
The sputtering step is implemented by sputtering a board surface of a ceramic substrate to form a sputtering layer
Implementation Method 2
The electroplating step is implemented by electroplating the electroplating portion of the sputtering layer to form a conductive block in the electroplating slot
Implementation Method 3
The electroless plating step is implemented by performing an electroless plating process on the conductive block to sequentially form a first electroless plating layer, a second electroless plating layer, and a third electroless plating layer
Data Source
AI summary
A power component submount includes a ceramic substrate, a sputtering layer formed on the ceramic substrate, a conductive block formed on the sputtering layer, and three electroless plating layers that are sequentially stacked on the conductive block. The sputtering layer includes an electroplating portion. The conductive block is formed on the electroplating portion, and bottoms of the three electroless plating layers are connected to the ceramic substrate. Materials of the three electroless plating layers are gold, palladium, and gold, respectively; or, materials of the three electroless plating layers are nickel, palladium, and gold, respectively. One of the three electroless plating layers arranged away from the conductive block is provided for allowing a power component to be mounted thereon.