Submount Electrode Segmentation for Optical Module Reliability
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Solution Overview
Problem
Conventional submounts for LED arrays have complex structures with wiring electrodes bent at 90 degrees, leading to manufacturing inefficiencies and potential rupture issues, requiring complicated processes and reducing yield.
Innovation Solution
A submount design featuring a first electrode layer laminated on the substrate surface and side surface, with a sealing member covering the surface and exposing the side surface for easy electrical connection, allowing for thicker electrodes and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wiring electrode is formed straddling a side surface and the main surface of the submount substrate with a bent section, then electrical connection between IC and light emitting element is achieved, but the structure becomes complex and manufacturing efficiency deteriorates
Solution Approach 1:
The electrode structure is segmented into two independent parts: a first electrode layer on the main surface and a second electrode layer on the side surface. This eliminates the need for a single complex bent electrode, simplifying the manufacturing process while maintaining electrical connection functionality between the IC and light emitting element.
Solution Approach 2:
The electrical connection path is redistributed across different dimensions and surfaces. Instead of bending an electrode in 3D space, the connection is achieved through separate planar electrode layers on the main and side surfaces, reducing structural complexity and improving manufacturability.
2Reliability
If the wiring electrode is formed with a bent section at about 90 degrees, then electrical connection is achieved, but the risk of rupture increases and manufacturing yield deteriorates
Solution Approach 1:
The single bent electrode is segmented into two straight electrode layers positioned on different surfaces. This eliminates the 90-degree bent section that is prone to rupture, replacing it with simpler straight electrode structures that are easier to manufacture with higher yield.
Solution Approach 2:
Instead of forming one continuous bent electrode, the approach is inverted to use two separate straight electrodes on different surfaces. This inverts the design philosophy from a single complex component to multiple simple components, reducing manufacturing difficulty and improving yield.
3Reliability
If the wiring electrode is formed straddling side surface and main surface, then electrical connection is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The manufacturing process is segmented into independent steps for forming the first electrode layer on the main surface and the second electrode layer on the side surface. This segmentation simplifies each individual process step compared to forming a single complex bent electrode, reducing overall process complexity while maintaining connection reliability.
Solution Approach 2:
The electrode configuration transitions from a single 3D bent structure to two separate 2D planar structures on different surfaces. This dimensional simplification makes each electrode layer easier to manufacture independently, reducing the complexity of the overall manufacturing process.
Data Source
AI summary
In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).