Submount Thermal Control for Multi-Laser Modules

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Solution Overview

Problem

Integrated optical transmitter modules with multiple semiconductor lasers face challenges in maintaining uniform temperature and stable optical characteristics across a wide operation temperature range, leading to issues with output wavelength changes and RF characteristics, due to limited space for heat generators and increased costs from additional components and circuits.

Innovation Solution

A submount design with a heat generator that differentially heats multiple semiconductor lasers, where the first heat generation portion generates more heat than the second, connected in series and driven by a single power source, to maintain temperature uniformity and stability across the semiconductor lasers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single Peltier element is used to control the temperature of the submount, then the structure is simple and cost-effective, but a significant temperature distribution occurs causing non-uniform temperatures of the semiconductor lasers

Engineering Contradiction:
Improvestructure simplicityVSAvoidtemperature uniformity
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The single Peltier element is segmented into multiple independent heating regions, each corresponding to a semiconductor laser position. This allows independent temperature control for each laser while maintaining structural simplicity and cost-effectiveness of using a single Peltier device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the Peltier element are designed with different thermal characteristics to match the specific requirements of each semiconductor laser. This ensures uniform temperature distribution across all lasers while using a single Peltier element structure.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If heat generators are separately mounted for each semiconductor laser, then temperature control precision is improved, but the device size increases and cost increases due to multiple wires and drive circuits

Engineering Contradiction:
Improvetemperature control precisionVSAvoidnumber of components
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Multiple heat generation functions are merged into a single Peltier element. The Peltier element is designed with multiple heating regions that can independently control temperatures of different semiconductor lasers, eliminating the need for separate heat generators, wires, and drive circuits for each laser.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single Peltier element serves multiple functions by providing temperature control for all semiconductor lasers simultaneously. Different regions of the Peltier element can be independently controlled to meet the specific temperature requirements of each laser, achieving multi-functionality with a single component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If the operation temperature range is widened, then the adaptability of the semiconductor lasers is improved, but the output wavelength changes significantly and RF characteristics deteriorate

Engineering Contradiction:
Improveoperation temperature rangeVSAvoidoptical characteristics stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

Temperature sensors are positioned near each semiconductor laser to provide real-time feedback on the actual temperature at the laser location. This feedback is used to dynamically adjust the current applied to corresponding regions of the Peltier element, ensuring stable temperature control and maintaining consistent optical characteristics across a wide ambient temperature range.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system actively adjusts the temperature parameter of each semiconductor laser to maintain optimal operating conditions despite changes in ambient temperature. By dynamically controlling the temperature of each laser individually, the system maintains stable output wavelength and RF characteristics across a wide operation temperature range.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for cost-effective miniaturization and reduced changes in optical characteristics of semiconductor lasers within an operation temperature range, ensuring stable RF characteristics and wavelength control across varying temperatures.

Implementation Method 1

a heat generator configured to increase the temperatures of the three or more semiconductor lasers

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

where the heat generator generates heat, a first heat of the heat absorbed by the first semiconductor laser disposed at one end along the first direction is larger than a second heat of the heat absorbed by the second semiconductor laser disposed to be adjacent to the first semiconductor laser

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10236660B2Submount, optical transmitter module, optical module, optical transmission equipment, and control method therefor
Publication Date: 2019.03.19 LUMENTUMRADIANT GMBH
  • US10236660B2 patent drawing
  • US10236660B2 patent drawing
  • US10236660B2 patent drawing

AI summary

A submount which has a mounting surface on which three or more semiconductor lasers are arranged in a first direction, and includes a heat generator configured to increase the temperatures of the three or more semiconductor lasers, in which, where the heat generator generates heat, a first heat of the heat absorbed by a first semiconductor laser of the three or more semiconductor lasers disposed at one end along the first direction is larger than a second heat of the heat absorbed by a second semiconductor laser of the three or more semiconductor lasers disposed to be adjacent to the first semiconductor laser on the mounting surface.