Submount Notch Curvature for Laser Dicing Flatness
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Solution Overview
Problem
Conventional submount manufacturing methods fail to accurately control the dividing section and achieve desired flatness due to burr issues, leading to inaccuracies in the position and flatness of the dividing surface.
Innovation Solution
A submount design with specific notch configurations, including first and second notch parts with curved surfaces, is implemented to improve the accuracy and flatness of the dividing surface by distributing force evenly during the division process, using a silicon wafer with etched through grooves and a processing laser to form modified regions for stealth dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a notch part is formed in a ridge line portion between a divided cross section of the submount and the surface adjacent to the divided cross section to accommodate burrs, then burr accommodation is improved, but force concentration occurs at the valley-like portion at the bottom of the notch part during division, causing inaccurate control of the dividing section and poor flatness
Solution Approach 1:
The notch part is designed with a curved surface instead of a flat bottom, creating a valley-like portion that smoothly transitions to the divided cross section. This curvature prevents force concentration during division while still providing effective burr accommodation, thereby maintaining both burr management and dividing section accuracy.
2Ease of manufacture
If conventional dicing blade division is used to divide the substrate, then manufacturing simplicity is maintained, but burrs are generated and the dividing surface flatness cannot be achieved
Solution Approach 1:
The notch part with a curved surface is pre-formed in the substrate before the division process. This preliminary structural preparation guides the division process by providing a predetermined path that maintains flatness while accommodating burrs, thereby achieving precise dividing surface without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed submount design enhances the accuracy and flatness of the dividing surface, reducing surface roughness and improving the bonding strength between the semiconductor laser chip and the submount, while minimizing solder flow to unwanted areas.
Implementation Method 1
a processing laser to form modified regions for stealth dicing
Data Source
AI summary
A submount includes a substrate, the substrate including: a first surface; a second surface that is perpendicular to the first surface; a third surface that is perpendicular to the first surface and the second surface; a fourth surface that is perpendicular to the first surface and the second surface, and is opposed to the third surface; a fifth surface that is perpendicular to the second surface and the third surface, and is opposed to the first surface; a sixth surface that is opposed to the second surface; a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other; and a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other, the first notch part and the second notch part each having a recessed surface.