Sub-pixel Gap Overlap for Sensor Integration
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Solution Overview
Problem
Existing electronic devices face challenges in integrating fingerprint identification and display functions efficiently, with overlapping sensor and display components leading to space and production inefficiencies.
Innovation Solution
The integration of a substrate with sub-pixels, sub-sensor units, and integrated circuit chips, where sub-sensor units overlap with gaps between sub-pixels, and demultiplexer units reduce the number of signal lines in the peripheral region, allowing for efficient electrical connection and reduced space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If sensor units and display units are integrated in the same active region, then space utilization is improved, but the number of signal lines increases
Solution Approach 1:
The patent combines sensor units and display units into the same active region, allowing them to share the same substrate and peripheral regions. This merging approach reduces the overall device area while managing signal line complexity through shared infrastructure.
Solution Approach 2:
The patent implements a multiplexer unit that handles both sensor signal reading and display signal control through a shared signal line infrastructure. This multi-functional approach allows the same physical lines to serve multiple purposes, reducing the total number of required signal lines.
2Measurement precision
If sub-sensor units overlap with gaps between sub-pixels, then sensing accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The patent places sub-sensor units specifically in the gap regions between sub-pixels rather than uniformly across the entire substrate. This localized positioning optimizes sensing accuracy by utilizing the optical properties of gap regions while simplifying the overall manufacturing process.
Solution Approach 2:
The patent positions sub-sensor units in the vertical dimension by overlapping them with gaps between sub-pixels along the normal direction of the substrate. This dimensional approach allows sensing functionality without requiring additional lateral space, thereby maintaining manufacturing feasibility.
3Device complexity
If demultiplexer units are used to reduce signal lines, then device complexity is reduced, but electrical connection reliability may worsen
Solution Approach 1:
The patent introduces demultiplexer units as intermediary components that act as signal distribution hubs. These demultiplexers receive signals from a reduced set of input lines and distribute them to multiple display units, thereby reducing overall wire complexity while maintaining reliable electrical connections through dedicated bonding pads and structured routing.
Data Source
AI summary
The present disclosure provides an electronic device including a first substrate, a plurality of sub-pixels, a first integrated circuit chip, a plurality of sub-sensor units, and a second integrated circuit chip. The first substrate has a surface, and the surface has a normal direction. The sub-pixels are disposed on the first substrate. The first integrated circuit chip is disposed on the first substrate and electrically connected to the sub-pixels. The sub-sensor units are disposed on the first substrate. The second integrated circuit chip is disposed on the first substrate and electrically connected to the sub-sensor units. A gap is included between two adjacent ones of the sub-pixels, and at least a portion of one of the sub-sensor units is overlapped with the gap along the normal direction.