Subrack With Segmented Air Ducts For Independent Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing subracks face issues with heat dissipation, as the heat from the front main boards is transferred to the rear main boards, leading to a high-temperature environment and accelerated aging, reducing device reliability.
Innovation Solution
A subrack design featuring separate first and second air ducts with independent air inlet and outlet arrangements, along with dedicated air exhaustion devices, to facilitate independent heat dissipation of the front and rear main board regions, preventing mutual heat interference and accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single air duct system is used for both front and rear main boards, then device complexity is reduced, but heat from front main boards accumulates and transfers to rear main boards causing high temperature and accelerated aging
Solution Approach 1:
The air duct system is segmented into a first air duct for the front main board region and a second air duct for the rear main board region. This segmentation prevents heat transfer between regions by creating separate airflow paths, thereby protecting the rear main boards from high temperatures while maintaining manageable system complexity through modular design.
Solution Approach 2:
A partition board is introduced as an intermediary structure between the front and rear main board regions. This partition board includes a first through-hole for the first air duct and a second through-hole for the second air duct, physically separating the airflow paths and preventing thermal interference between the two regions.
2Device complexity
If air is exhausted from the rear wall only, then heat dissipation path is simplified, but heat accumulation occurs in the rear main board region
Solution Approach 1:
The air exhaustion function is segmented into a first air exhaustion device for the front main board region and a second air exhaustion device for the rear main board region. Both devices are arranged on the rear wall but serve separate airflow paths, enabling independent heat dissipation for each region and preventing heat accumulation in the rear main board area.
3Reliability
If separate air ducts are implemented for front and rear main boards, then independent heat dissipation is achieved, but device complexity increases
Solution Approach 1:
The air duct system is divided into separate first and second air ducts with dedicated airflow paths for front and rear main board regions respectively. This segmentation enables independent heat dissipation, preventing thermal interference while the modular structure keeps the complexity increase manageable.
Solution Approach 2:
The partition board serves multiple functions: it physically separates the air ducts, provides structural support for mounting air exhaustion devices, and organizes the airflow paths. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat accumulation and enhances heat dissipation efficiency by shortening ventilation paths and ensuring independent cooling of both main board regions, thereby improving device reliability and longevity.
Implementation Method 1
a first air exhaustion device for driving air to be exhausted from the rear wall of the chassis, wherein the air enters the first air duct from the first air inlet, and then flows through the first main board region to the rear wall
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention relates to a subrack and a terminal. The subrack includes a chassis, a first main board region arranged in a front part of the chassis, and a second main board region arranged at a rear of the chassis and also includes: a first air duct arranged in the chassis, wherein a first air inlet of the first air duct is arranged on a front wall of the chassis, the first air inlet and the first main board region are relatively arranged, and a first air outlet of the first air duct is arranged on a rear wall of the chassis; a second air duct arranged in the chassis, wherein the second air duct and the first air duct are separated, a second air inlet of the second air duct is arranged on the front wall of the chassis, the second air inlet is located below the first main board region and a second air outlet of the second air duct is arranged on the rear wall of the chassis.