Horizontal Subrack Ventilation Layout for Even Board Slot Cooling

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Solution Overview

Problem

The existing horizontal subracks in electronic and communication equipment suffer from uneven air distribution due to axial flow fans, which limits their heat dissipation capability because the cool air is not sufficiently mixed before reaching the board slots, resulting in inadequate airflow to all slots.

Innovation Solution

The design includes a ventilation box with an air partition plate that divides it into an air-in chamber and an air-out chamber, with the fan box located in the air-in chamber and air inlets/outlets positioned accordingly, along with air-in and air-out ducts on either side of the board slots, to extend the airflow path and ensure even air distribution to all slots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If an axial flow fan is used to dissipate heat directly onto the board, then the heat dissipation structure is simple, but the air volume distribution to board slots is uneven

Engineering Contradiction:
Improveheat dissipation structureVSAvoidair volume distribution evenness
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The ventilation box is segmented into multiple independent air outlets, each equipped with adjustable air volume control components. This divides the single airflow path into multiple controllable channels, allowing precise regulation of air distribution to different board slots while maintaining overall structural simplicity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The air volume control components are designed to be adjustable, enabling dynamic regulation of airflow to different board slots based on actual heat dissipation requirements. This dynamic adaptability allows the system to optimize air distribution without complex fixed structures

Inventive Principle:
Principle #15Dynamics

2Volume of moving object

If the fan hub directly blows cool air onto the board, then the structure is compact, but the cool air is not mixed sufficiently

Engineering Contradiction:
Improvesubrack widthVSAvoidair mixing uniformity
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

Air guiding components are introduced as intermediaries between the fan and board slots. These components redirect and diffuse the airflow from the fan hub, promoting mixing while maintaining the compact subrack structure. The intermediaries enable sufficient air mixing without requiring increased subrack width

Inventive Principle:
Principle #24Intermediary (Mediator)

3Length of moving object

If the fan blows cool air directly onto the board, then the airflow path is short, but the heat dissipation capability is limited

Engineering Contradiction:
Improveairflow path lengthVSAvoidheat dissipation capability
Core Design Contradiction:
Length of moving objectVSProductivity

Solution Approach 1:

The air outlets are arranged in multiple spatial dimensions and orientations to distribute cool air to different board slots simultaneously. This multi-dimensional air distribution approach extends the effective heat dissipation coverage without lengthening the overall airflow path, thereby enhancing heat dissipation capability within the same spatial constraints

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces the impact of the fan hub on airflow and ensures even air volume distribution to all board slots, enhancing the heat dissipation capability of the horizontal subrack.

Implementation Method 1

Under the effect of the axial flow fan, the airflow enters the board area 14 to dissipate heat for the boards

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

The air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber

Methodology Applied
Scientific EffectPhysical Containment: Physical Containment

Implementation Method 3

the airflow enters the board area 14 to dissipate heat for the boards in the board area 14

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS8514571B2Horizontal subrack and communication cabinet
Publication Date: 2013.08.20 HUAWEI TECH CO LTD
  • US8514571B2 patent drawing
  • US8514571B2 patent drawing
  • US8514571B2 patent drawing

AI summary

A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.