Subring Projection Design for Semiconductor Die Spacing
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Solution Overview
Problem
Current semiconductor wafer handling systems face challenges in adequately spacing dies post-dicing due to limited tape expansion, leading to die-to-die collisions and chipping, especially as die sizes shrink, and existing subrings are prone to wear and limited in their ability to maintain clamping efficacy.
Innovation Solution
A subring system with a base and projection design that expands tape by inserting sections through a frame passage, using a cap to maintain tension and prevent movement, allowing for increased tape expansion and die spacing, and utilizing durable materials to prevent wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing subrings are used to hold tape, then the tape can be clamped to the frame, but the subrings are prone to wear and have limited ability to maintain clamping efficacy
Solution Approach 1:
The subring is divided into multiple replaceable sections that can be individually replaced when worn. This segmentation allows the system to maintain clamping efficacy over time by replacing only the worn sections rather than the entire subring, resolving the contradiction between reliability and duration of action.
Solution Approach 2:
The projection geometry is optimized with specific curvature radii (e.g., 0.020-0.040 inches) to reduce stress concentration and wear. By changing the geometric parameters of the projection, the subring maintains clamping efficacy longer while reducing wear-related failures.
2Length of moving object
If tape expansion is limited, then the existing frame structure can be maintained, but die-to-die collisions and chipping occur as die sizes shrink
Solution Approach 1:
The subring projection is designed to apply dynamic clamping force that can be adjusted during the die separation process. The projection expands the tape by applying controlled force, increasing die spacing dynamically to prevent collisions while maintaining control over the process.
Solution Approach 2:
The solution moves from two-dimensional tape handling to three-dimensional expansion by inserting the subring projection through the tape thickness and applying force from both sides. This dimensional change enables greater die spacing control and prevents chipping by distributing forces more effectively.
3Force
If the subring projection is made larger to increase clamping force, then clamping efficacy improves, but the projection becomes more prone to wear and damage
Solution Approach 1:
The projection dimensions are optimized with specific parameters (radius 0.020-0.040 inches, length 0.060-0.120 inches) that balance clamping force generation with wear resistance. These parameter changes allow the projection to be small enough to resist wear but large enough to provide adequate clamping force.
Solution Approach 2:
The subring is made from wear-resistant materials such as ceramic-coated metal or hardened polymer composites. These composite materials provide both the necessary clamping force and enhanced durability, resolving the contradiction between force generation and wear resistance.
Data Source
AI summary
A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.