Subsea Thermal Insulation Structure for High-Temperature Flexibility
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Solution Overview
Problem
Conventional thermal insulation materials for subsea equipment become brittle and lose mechanical flexibility at high temperatures above 150 degrees centigrade, compromising their effectiveness in maintaining fluid temperature and withstanding seawater and pressure.
Innovation Solution
A thermal insulation structure comprising an inner and outer layer, where the inner layer is a reaction product of alkenyldialkyl terminated polydialkylsiloxane or its mixtures with a hydrosilylation catalyst, and the outer layer is a reaction product of alkenyldialkyl terminated polydialkylsiloxane or its mixtures with alkenylated MQ silicone resin, both with specific viscosity ranges and Si-H bond configurations, providing low thermal conductivity and mechanical flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal insulation materials are used, then thermal insulation performance is achieved, but mechanical flexibility is lost at high temperatures above 150 degrees centigrade
Solution Approach 1:
The patent applies composite materials by combining multiple silicone resin components (polydialkylsiloxane, polydialkylalkenylmethylsiloxane, and MQ silicone resin) with specific molecular structures and crosslinking densities to create a multi-phase composite insulation structure that maintains flexibility at high temperatures
Solution Approach 2:
The patent changes material parameters by controlling the viscosity ratio of components (250-10000 mPa·s), adjusting crosslinking density through Si-H bond configuration (two vs at least three bonds), and optimizing weight ratios of first part to second part (15:1 to 1:1) to achieve high-temperature flexibility
2Loss of energy
If thermal insulation materials with low thermal conductivity are used, then insulation effectiveness is improved, but brittleness increases at high temperatures
Solution Approach 1:
The patent applies local quality by creating distinct inner and outer layers with different compositions and properties - the inner layer uses specific organohydrogensiloxane configurations for flexibility while the outer layer uses alkenylated MQ silicone resin for environmental resistance, each optimized for its specific functional requirement
Solution Approach 2:
The patent segments the insulation structure into multiple functional layers with different material compositions, where the inner layer focuses on maintaining flexibility and low thermal conductivity while the outer layer provides environmental protection, allowing each segment to optimize its specific function
3Ease of manufacture
If single-layer thermal insulation structure is used, then manufacturing simplicity is maintained, but performance consistency at varying temperatures is compromised
Solution Approach 1:
The patent applies dynamics by designing a multi-layer structure where each layer responds differently to temperature changes - the inner layer maintains flexibility through specific crosslinking densities while the outer layer provides stable protection, allowing the composite structure to adapt its mechanical properties dynamically across temperature ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure maintains mechanical flexibility and low thermal conductivity even at high temperatures, with the inner layer absorbing stress and the outer layer protecting against external conditions, effectively insulating subsea equipment.
Implementation Method 1
the inner layer being the reaction product of a first part and a second part, wherein the first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, and a hydrosilylation catalyst, wherein the second part comprises a mixture of organohydrogensiloxane having two Si—H bonds per molecule and organohydrogensiloxane having at least three Si—H bonds per molecule
Implementation Method 2
the outer layer being the reaction product of a first part and a second part, wherein the first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, and a hydrosilylation catalyst, wherein the second part comprises organohydrogensiloxane having at least two Si—H bonds per molecule and alkenylated MQ silicone resin, having at least two Si-alkenyl bonds per molecule
Implementation Method 3
Thermal insulation must have a low thermal conductivity and exhibit the required mechanical properties, such as flexibility
Data Source
AI summary
A thermal insulation structure for a substrate for use subsea, and a method of providing a thermal insulating structure. The structure comprises: an inner layer and an outer layer. The inner layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises a mixture of organohydrogensiloxane having two Si—H bonds per molecule and organohydrogensiloxane having at least three Si—H bonds per molecule. The outer layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises organohydrogensiloxane having at least two Si—H bonds per molecule and alkenylated MQ silicone resin, wherein said M group comprises at least two Si-alkenyl bonds per molecule.