Substrate Processing Abnormality Detection Using Merged Imaging

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Solution Overview

Problem

Existing substrate processing systems face challenges in efficiently correcting processing conditions without deteriorating productivity, especially when the number of imaging devices is limited, as they require multiple imaging units for accurate film thickness measurement across layered films, leading to increased costs and reduced productivity.

Innovation Solution

A method and system that utilize a limited number of imaging devices by imaging substrates before and after processing series, specifying potentially abnormal processing apparatuses, performing unit processing on inspection substrates, and correcting conditions based on imaging results to determine and address actual abnormalities, thereby maintaining productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple imaging devices are used to measure film thickness distribution before and after heating processing, then measurement precision is improved, but device complexity and cost increase

Engineering Contradiction:

Improvefilm thickness measurement precisionVSAvoidnumber of imaging devices

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines the functions of multiple imaging devices into a single imaging device that performs both pre-heating and post-heating imaging. The imaging device is configured to image the substrate at different stages of the processing sequence, eliminating the need for separate imaging devices for each measurement point.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The imaging device is designed with multi-functionality to perform various imaging tasks including pre-heating imaging, post-heating imaging, and abnormality detection across different processing apparatuses. A single device handles multiple measurement requirements that previously required dedicated imaging devices for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple imaging devices are deployed for accurate film thickness measurement, then manufacturing precision is improved, but productivity deteriorates due to increased standby times

Engineering Contradiction:

Improveline width uniformityVSAvoidsubstrate processing throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

By merging multiple imaging functions into a single imaging device, the patent eliminates the need for substrates to wait for multiple separate imaging devices to become available. The single device can continuously process imaging requests without coordination delays between multiple devices, thereby maintaining productivity while achieving precise measurements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The imaging device maintains continuous operation by seamlessly transitioning between different imaging tasks (pre-heating imaging, post-heating imaging, abnormality detection). This continuous operation eliminates idle time and standby periods that would occur if multiple specialized imaging devices were coordinated, ensuring uninterrupted substrate processing.

Inventive Principle:

Principle #20Continuity of useful action

3Loss of time

If imaging is performed only before and after series of processings, then loss of time is reduced, but measurement precision may deteriorate

Engineering Contradiction:

Improveimaging time per substrateVSAvoidabnormality detection accuracy

Core Design Contradiction:

Loss of timeVSMeasurement precision

Solution Approach 1:

The patent implements a feedback mechanism where imaging results from both pre-series and post-series imaging are analyzed to detect abnormalities. The system uses the comparison between before and after imaging data to identify processing apparatus abnormalities, maintaining detection accuracy while minimizing the number of imaging operations required.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS11610298B2Method for determining an abnormality and substrate processing system

Publication Date: 2023.03.21 TOKYO ELECTRON LTD

AI summary

A method for a substrate processing system includes imaging a substrate before start and after completion of a series of processings on the substrate; specifying a first processing apparatus estimated as having a potential abnormality among a plurality of processing apparatuses; performing a first process on a first inspection substrate under a selected processing condition using the first processing apparatus specified in the specifying, and imaging the first inspection substrate before and after the performing the first process to acquire a first imaging result; performing a second process on a second inspection substrate using a second processing apparatus, and imaging the second inspection substrate for comparison before and after the performing the second process to acquire a second imaging result; and determining whether an actual abnormality exists in the first processing apparatus, based on the first imaging result and the second imaging result.