Substrate Surface Treatment for Flexible Display Separation
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Solution Overview
Problem
The challenge in manufacturing thin and flexible display devices is the difficulty in separating thin glass substrates from carrier substrates due to permanent bonding caused by the heat treatment process during thin film formation, which complicates the production of thin and light display devices.
Innovation Solution
A method involving surface treatment of the substrates with inorganic or organic acids to control the content of —OH, —OH2+, and —O− groups, allowing for easier separation by controlling the bonding between the substrates, which includes cleaning, heat treatment, and acid treatment to manage the surface chemistry and prevent permanent adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat treatment is performed during thin film formation on the mother substrate, then thin film formation is achieved, but permanent bonding occurs between the carrier substrate and mother substrate making separation difficult
Solution Approach 1:
The patent applies preliminary surface treatment to the carrier substrate and/or mother substrate before bonding, specifically introducing —OH2+ groups or controlling —OH group content. This preliminary chemical modification ensures that when heat treatment is later applied for thin film formation, the substrates will not permanently bond, allowing easy separation while still achieving proper thin film formation.
Solution Approach 2:
The patent changes the chemical parameters of the substrate surfaces by controlling the content of —OH, —OH2+, and —O− groups through acid treatment. By adjusting these chemical parameters before bonding, the substrate pair achieves optimal properties: sufficient adhesion for thin film formation but controlled bonding that allows easy separation afterward.
2Length of moving object
If the thin glass substrate is used as a mother substrate, then the display device thickness is reduced, but the substrate bends after contacting the carrier substrate
Solution Approach 1:
The patent performs preliminary surface treatment on the thin glass substrate before bonding to the carrier substrate. This treatment introduces —OH2+ groups or controls —OH group content, creating a chemical state that prevents excessive bonding during subsequent heat treatment. As a result, the thin substrate maintains its flatness and resists bending while still achieving the necessary adhesion for the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the successful separation of substrates after thin film formation, facilitating the production of thin and flexible display devices by controlling the surface chemistry and preventing permanent bonding, thus improving the manufacturing process efficiency.
Implementation Method 1
the surface treatment includes using an inorganic acid or an organic acid, and the surface treatment controls a content of —OH, —OH2+, and —O− groups of at least one of the opposing surfaces
Implementation Method 2
The thin film formation process includes a heat treatment
Data Source
AI summary
A method of manufacturing a display device that includes: performing a surface treatment on at least one of two opposing surfaces of a carrier substrate and a mother substrate; bonding the carrier substrate and the mother substrate; performing a thin film formation process on the mother substrate; and separating the carrier substrate and the mother substrate. The thin film formation process includes a heat treatment operation, the surface treatment includes using an inorganic acid or an organic acid, and the surface treatment controls a content of —OH, —OH2+, and —O− groups of the at least one treated surface.