Substrate Adapter With Predetermined Breaking Points
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Solution Overview
Problem
Existing substrate adapter production methods result in uncontrolled breakages of porous or sinterable layers during detachment, leading to reduced production yield and product quality due to rejects and defective parts.
Innovation Solution
Incorporating a contacting material layer with predetermined breaking points, such as material recesses or three-dimensional structures, to enable controlled detachment from the carrier, preventing uncontrolled breakages and ensuring reproducible part separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If porous or sinterable layers are detached from carrier film in prior art methods, then substrate adapter can be formed and used for connecting electronic components, but uncontrolled breakages occur within the layers during detachment
Solution Approach 1:
The patent applies preliminary action by pre-defining breaking points in the contacting material layer before detachment occurs. These breaking points are created during the layer formation process, allowing the layer to separate cleanly from the carrier film at predetermined locations without uncontrolled breakage. This resolves the contradiction by preparing the structure in advance to ensure reliable detachment.
Solution Approach 2:
The patent applies segmentation by dividing the contacting material layer into regions with different detachment characteristics. By creating specific breaking points at certain locations while maintaining integrity at others, the layer is segmented into functional zones that detach controllably. This allows the substrate adapter to be formed reliably without compromising layer integrity during the detachment process.
2Productivity
If uncontrolled breakages occur in contacting material layer, then production yield decreases and product quality deteriorates due to rejects and defective parts
Solution Approach 1:
The patent improves manufacturing precision by pre-defining breaking points during the layer formation process. This preliminary structuring ensures that detachment occurs exactly where intended, eliminating uncontrolled breakages and reducing rejects. The result is higher production yield with fewer defective parts, directly resolving the contradiction between productivity and manufacturing precision.
3Adaptability or versatility
If contacting material layer is made porous or sinterable for electronic component connection, then connection capability is improved, but layer becomes more prone to uncontrolled breakage during detachment
Solution Approach 1:
The patent applies local quality by creating different structural properties at different locations within the contacting material layer. The breaking point regions have modified properties that facilitate controlled separation, while other regions maintain the porous or sinterable characteristics needed for electronic component connection. This local differentiation resolves the contradiction between connection capability and structural integrity during detachment.
Solution Approach 2:
The patent uses preliminary action to pre-structure the contacting material layer with defined breaking points before detachment. This allows the layer to maintain its porous or sinterable properties for good connection capability while having predetermined weak points that guide clean separation. The preliminary structuring prevents uncontrolled breakage while preserving the layer's functional properties for electronic component connection.
Data Source
AI summary
One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.