Substrate Processing Airflow Heating for Low-Humidity Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor substrate cleaning methods, particularly spin-type wet cleaning, face challenges in effectively managing humidity and temperature to maintain low-humidity clean air flow, which is crucial for removing contaminants without compromising the substrate's integrity.
Innovation Solution
The substrate processing apparatus incorporates a fan filter unit with heaters arranged to control air flow and temperature, ensuring low-humidity clean air is supplied by optimizing heat distribution around the substrate processing unit, including internal and external heaters and a controller to manage heat supply based on the substrate's position and entry/exit stages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fan filter unit is used to supply clean air in spin-type wet cleaning, then clean air flow is achieved, but humidity control becomes difficult
Solution Approach 1:
The fan filter unit is divided into multiple independent heating zones with separate heaters positioned at different locations (top, bottom, side walls) to provide localized temperature control throughout the air flow path, enabling precise humidity management while maintaining clean air supply
Solution Approach 2:
Heaters are strategically positioned at specific locations within the fan filter unit (top wall, bottom wall, side walls) to create localized heating zones that address humidity control at different points in the air flow, allowing differential temperature management to optimize overall humidity control
2Temperature
If multiple heaters are added to control humidity, then humidity control improves, but device complexity increases
Solution Approach 1:
The multiple heaters serve dual functions: they heat the air to control humidity and simultaneously define distinct heating zones for differential temperature management. The same heater structures that provide thermal control also serve as structural components of the fan filter unit, reducing the need for additional separate elements
Solution Approach 2:
The heating elements are integrated directly into the fan filter unit structure, merging the temperature control function with the air filtration and distribution structure. This integration eliminates the need for separate heating assemblies and reduces overall system complexity despite adding multiple heating zones
3Temperature
If heaters are positioned inside the fan filter unit, then humidity control improves, but power consumption increases
Solution Approach 1:
Heaters are positioned only at specific critical locations within the fan filter unit (top, bottom, and side walls) rather than uniformly throughout, providing targeted heating where it is most effective for humidity control while minimizing unnecessary energy consumption in other areas
Solution Approach 2:
The heating system applies heat selectively in specific zones rather than uniformly across the entire fan filter unit. This partial heating approach provides sufficient humidity control through localized thermal management while reducing overall power consumption compared to full-coverage heating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient substrate processing by maintaining low humidity and optimizing heat supply, enhancing the cleaning process's effectiveness while minimizing power usage.
Implementation Method 1
a fan arranged inside the fan housing and configured to flow air from the open top to the open bottom of the fan housing
Implementation Method 2
a pair of first heaters arranged spaced apart from each other in a first horizontal direction with the fan therebetween and configured to supply heat
Data Source
AI summary
Provided is a substrate processing apparatus including a substrate processing unit including a support member configured to support a substrate, an entrance on one side of the substrate processing unit configured to allow the substrate to enter and exit the substrate processing unit, and a housing configured to accommodate the substrate, and a first blowing member configured to supply air, wherein the first blowing member includes a fan housing with an open top and an open bottom, a fan arranged inside the fan housing and configured to flow air from the open top to the open bottom of the fan housing, a pair of first heaters arranged spaced apart from each other in a first horizontal direction with the fan therebetween and configured to supply heat.