Substrate Treatment Airflow Separation for Uniform Liquid Films

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Solution Overview

Problem

The existing substrate treating apparatuses face issues with air flow stagnation and vortex formation when treating rotating substrates, leading to non-uniform film thickness and contamination due to the collision of air flows with the outer cup, which complicates the evacuation of air and reintroduces contaminants to the substrate.

Innovation Solution

The apparatus incorporates a first and second gas-liquid separator within the processing container, along with an air flow guide duct, to manage air flow tangentially and prevent stagnation, ensuring smooth air flow evacuation and uniform liquid film distribution across the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the substrate rotates at high speed to improve treatment efficiency, then productivity increases, but air flow stagnation and vortex formation worsen due to centrifugal force

Engineering Contradiction:
Improvesubstrate treatment efficiencyVSAvoidair flow stagnation and vortex
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The exhaust system is segmented into multiple exhaust holes distributed around the inner cup, allowing air flow to be evacuated at different locations and reducing stagnation zones that would form with a single exhaust point

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The inner cup acts as an intermediary structure between the substrate and outer cup, creating a controlled air flow path that guides centrifugal air flow toward the exhaust holes without direct collision with the outer cup wall

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the air flow is exhausted through the outer cup to simplify the exhaust structure, then device complexity decreases, but film thickness uniformity worsens due to air flow collision and stagnation

Engineering Contradiction:
Improveexhaust structure complexityVSAvoidliquid film thickness uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The exhaust function is segmented into multiple holes in the inner cup rather than a single exhaust point, distributing the air flow evacuation across multiple locations to prevent localized stagnation that would cause film thickness variations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The exhaust holes are positioned at the bottom of the inner cup, utilizing the vertical dimension to evacuate air flow before it can collide with the outer cup wall, thereby maintaining horizontal air flow uniformity across the substrate surface

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If the exhaust tube is positioned at the bottom of the inner space to simplify evacuation, then ease of operation improves, but contamination increases due to vortex formation and air flow reversal

Engineering Contradiction:
Improveair flow evacuation efficiencyVSAvoidsubstrate contamination
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The inner cup serves as an intermediary exhaust structure with its own exhaust holes, preventing direct communication between the bottom exhaust tube and the substrate area, thereby blocking the reverse flow path that would transport contaminants back to the substrate

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The exhaust function is extracted from the outer cup structure and implemented separately in the inner cup, allowing independent optimization of the exhaust path to prevent contaminant recirculation while maintaining evacuation efficiency

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures uniform liquid film thickness and prevents re-contamination by efficiently managing air flow and liquid distribution, improving the overall treatment process for substrates.

Implementation Method 1

an air flow 84 on the surface of the substrate W flows from the center of the substrate W toward the edge thereof along the rotating direction of the substrate W by the centrifugal force

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Implementation Method 2

When the substrate treating apparatus 1 treats the substrate W while supplying the treating liquid 82 on the rotating substrate W

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS12125717B2Apparatus for treating substrate
Publication Date: 2024.10.22 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12125717B2 patent drawing
  • US12125717B2 patent drawing
  • US12125717B2 patent drawing

AI summary

An apparatus for treating a substrate, the apparatus comprising: a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit supplying treating liquid to the substrate supported by the support unit; and an exhaust unit exhausting an air flow in the inner space, wherein the processing container includes a bottom wall and a side wall extending from the outside end of the bottom wall, the processing container including a first gas-liquid separator provided at the side wall.