Substrate Alignment via Characteristic Features
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Solution Overview
Problem
Existing methods for aligning and bonding substrates face challenges in maintaining alignment accuracy over long distances and have low throughput, particularly due to the need for precise and lengthy alignment processes and the complexity of alignment systems.
Innovation Solution
A method and system that measure and assign alignment marks to characteristic substrate features before bonding, allowing for precise alignment using these features rather than the marks themselves, and utilizing a controlled atmosphere in a bonding chamber to enhance bonding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a complex alignment system is used to achieve high alignment accuracy, then alignment precision is improved, but device complexity and throughput are worsened
Solution Approach 1:
The alignment system is segmented into two independent parts: (1) alignment mark detection and measurement, and (2) substrate positioning based on characteristic features. This segmentation allows each part to be optimized independently, reducing overall system complexity while maintaining alignment accuracy through the decoupling of detection and positioning functions.
Solution Approach 2:
Characteristic substrate features serve as an intermediary between the alignment marks and the final substrate positioning. Instead of directly using alignment marks for positioning, the system first identifies characteristic features and then uses them as reference points for accurate substrate placement, simplifying the alignment process.
2Adaptability or versatility
If a complex alignment system with multiple alignment methods is used, then alignment versatility is improved, but throughput is worsened
Solution Approach 1:
The alignment system achieves universality by using a single detection method that can identify both alignment marks and characteristic substrate features. This multi-functional approach eliminates the need for separate alignment systems for different alignment methods, thereby increasing throughput while maintaining versatility.
Solution Approach 2:
The system performs preliminary detection and identification of characteristic substrate features before the actual alignment process. This preliminary action allows for pre-calculation of positioning parameters, enabling faster execution of the alignment process and improving overall throughput.
3Manufacturing precision
If alignment is performed continuously during bonding to maintain accuracy, then alignment precision is improved, but processing time is worsened
Solution Approach 1:
All alignment measurements and calculations are performed in advance before the bonding process begins. The system pre-determines the positions of alignment marks and characteristic features, and pre-calculates the positioning parameters. This preliminary action eliminates the need for continuous alignment adjustments during bonding, reducing processing time while maintaining accuracy.
Solution Approach 2:
The system uses feedback from the detected positions of alignment marks and characteristic features to pre-adjust substrate positioning parameters. This feedback mechanism ensures that alignment accuracy is maintained without requiring continuous monitoring during the bonding process, thereby reducing overall processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains high alignment accuracy without the need for continuous alignment during bonding, increases throughput by reducing evacuation time, and allows for precise bonding under controlled gas conditions, particularly beneficial for metal-to-metal bonds.
Implementation Method 1
One type of bonder that is preferably used according to the invention is thermocompression bonders. With the help of a thermocompression bonder, high pressures and high temperatures can be generated.
Implementation Method 2
The extremely clean surfaces of the substrates result in self-fixation due to the adhesive forces between the substrate surfaces. The adhesion forces are mainly van der Waals forces.
Implementation Method 3
which is produced in a further process step by heat treatment and the associated creation of covalent bonds
Data Source
Figure 1
Figure 2a~2c
Figure 3
AI summary
The invention relates to a method for aligning a first substrate (7) having at least two first alignment marks (8) with a second substrate (7') having at least two second alignment marks (8'), wherein via a first assignment, the first alignment marks (8) are assigned to at least two first characteristic alignment features (9) of the first substrate (7) in an X-direction and in a Y-direction, via to a second assignment, the second alignment marks (8') are assigned to at least two second characteristic alignment features (9') of the second substrate (7') in an X-direction and in a Y-direction, and via to an alignment, the first (8) and the second alignment marks (8') are aligned with one another in the X- and Y-directions by means of the first and second characteristic alignment features (9, 9'). The invention further relates to a corresponding device.