Substrate Alignment Members for Tight-Tolerance Component Placement

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Solution Overview

Problem

Existing methods for aligning components on substrates often fail to meet spatial positioning and alignment tolerances, leading to inaccuracies in component placement, which can affect the functionality and performance of systems or devices.

Innovation Solution

A method and system that involve extending alignment members through openings in the substrate to abut against components, using magnetic forces, surface tension, or gravity to align them accurately along two linearly-independent directions, and securing them using solder or adhesives, with retractable mechanisms to refine the positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If existing alignment methods are used, then component placement is performed, but spatial positioning and alignment tolerances are not met

Engineering Contradiction:
Improvespatial positioning accuracyVSAvoidalignment tolerance compliance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces alignment members as intermediary elements that extend through openings in the substrate to physically contact and position the component. These alignment members serve as mediators between the substrate and the component, enabling precise spatial positioning by abutting against component edges and providing mechanical reference surfaces that ensure alignment tolerance compliance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The alignment members are extended through the substrate openings before the component is permanently secured. This preliminary positioning action allows the component to be accurately aligned and held in the correct spatial position before final attachment, ensuring that alignment tolerances are met prior to permanent fixation.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If alignment members are extended through openings to abut against components, then alignment accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvecomponent alignment accuracyVSAvoidalignment mechanism complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment mechanism is segmented into discrete alignment members that can be individually extended through specific openings in the substrate. Each alignment member handles a specific positioning function, allowing the overall alignment system to achieve high accuracy without requiring a monolithic complex mechanism. The segmented approach enables modular assembly and simplifies the alignment process.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise alignment of components within tight spatial tolerances, improving the accuracy and reliability of component placement on substrates, thereby enhancing the performance and functionality of assembled systems or devices.

Implementation Method 1

The moving the component may comprise exerting a magnetic force between the alignment member and the component to attract the component towards the alignment member. The alignment member may comprise an electromagnet; and the exerting the magnetic force may comprise electrifying the electromagnet.

Methodology Applied
Scientific EffectMagnetic force: Magnetism

Implementation Method 2

The providing the quantity of the liquid may comprise providing a plurality of sub-quantities of the liquid spaced from one another. The providing the plurality of the sub-quantities of the liquid may comprise providing the plurality of the sub-quantities arranged periodically on the substrate to form a grid.

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 3

The moving the component may comprise tilting the substrate to cause gravity to pull the component towards the alignment member.

Methodology Applied
Scientific EffectGravity: Gravitation

Implementation Method 4

The providing the liquid may comprise providing a solid solder disposed on the substrate between the substrate and the component; and melting the solid solder. The securing the component to the substrate may comprise soldering the component to the substrate.

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS11711898B2Methods and systems for aligning a component
Publication Date: 2023.07.25 GOOGLE LLC
  • US11711898B2 patent drawing
  • US11711898B2 patent drawing
  • US11711898B2 patent drawing

AI summary

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.