Substrate Alignment Mechanism for Eccentric Rotation Control
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Solution Overview
Problem
Existing substrate cleaning devices face challenges in accurately aligning substrates during transfer from suction pads to spin chucks, leading to eccentric rotation and uneven cleaning due to misalignment, which affects the uniformity of the cleaning process.
Innovation Solution
A substrate alignment device utilizing first and second support members with a pressing mechanism to accurately position the substrate, supported by movement limiters and adjustable pressing members to ensure precise alignment and fixation, reducing contamination and increasing the size range of substrates that can be aligned.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is transferred from suction pads to spin chuck without accurate alignment, then the transfer process is simple, but the substrate rotates eccentrically during spin chuck rotation causing non-uniform cleaning
Solution Approach 1:
The patent introduces a spin chuck as an intermediary device between the suction pads and the cleaning process. The spin chuck receives the substrate from the suction pads and provides a stable rotation platform with built-in alignment features, mediating the transfer process to ensure accurate positioning without requiring complex direct alignment mechanisms between suction pads and cleaning elements
Solution Approach 2:
The patent implements preliminary alignment actions by equipping the spin chuck with alignment marks and detection mechanisms that position the substrate correctly before the cleaning process begins. The substrate is aligned with the rotation shaft and cleaning elements in advance, preventing eccentric rotation during the actual cleaning operation
2Manufacturing precision
If the substrate is held by suction with the center deviated from the rotation shaft, then the suction holding is simple, but the air flow around the rotating substrate is disturbed affecting cleaning uniformity
Solution Approach 1:
The spin chuck is designed with self-aligning features including alignment marks on the substrate and corresponding detection mechanisms on the spin chuck. The substrate automatically positions itself relative to the rotation shaft through these built-in alignment features, eliminating the need for external alignment operations or complex positioning procedures
Solution Approach 2:
The patent replaces complex mechanical alignment mechanisms with optical or magnetic alignment systems. Alignment marks detected by sensors or magnetic indicators guide the substrate positioning, substituting intricate mechanical adjustment systems with simpler detection-based positioning methods
3Manufacturing precision
If the brush contact state changes with rotation angle due to misalignment, then the cleaning mechanism is simple, but uniform cleaning of the back-surface peripheral portion cannot be achieved
Solution Approach 1:
The spin chuck aligns the substrate with the cleaning elements before rotation begins, ensuring that the brush maintains consistent contact with the substrate surface throughout the rotation. This preliminary positioning prevents variable contact states during cleaning, maintaining uniform cleaning effectiveness across the entire substrate periphery
Data Source
AI summary
A substrate alignment device includes first and second support members that are arranged to be opposite to each other and be spaced apart from each other in a plan view, and respectively support an outer peripheral end of a substrate from a position below the substrate. Further, the substrate alignment device includes a first pressing member that is arranged to be opposite to the first support member in a plan view, and moves the substrate by pressing one portion of the outer peripheral end of the substrate in a first direction directed from the second support member toward the first support member with the substrate supported by the first and second support members. The first support member includes a movement limiter that limits movement of the substrate in the first direction past a predetermined prescribed position.