Substrate Alignment Features for Multi-Chip Module Assembly
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Solution Overview
Problem
Current multi-chip module (MCM) alignment techniques, such as ball-and-pit alignment, are costly and complex due to the high cost of silicon substrates, difficulty in positioning micro-spheres, and incompatibility with lower-cost substrates, making them prohibitive for high-performance computers requiring ultrafast chip-to-chip communication.
Innovation Solution
The use of positive features on substrates, such as trapezoidal, top-hat, pyramidal, or hemispherical shapes, that protrude above the surface and mate with corresponding features on another substrate, facilitating mechanical coupling and alignment, which can be fabricated using additive processes and materials like dielectric or organic siloxane, and can be made compliant initially to ease assembly and then cured for increased rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ball-and-pit alignment technique is used, then alignment precision is achieved, but manufacturing cost increases significantly
Solution Approach 1:
The patent replaces expensive silicon substrates with etch pits with inexpensive organic or ceramic substrates with printed positive alignment features. The alignment features are created using low-cost printing processes rather than expensive silicon fabrication, directly reducing manufacturing cost while maintaining alignment precision.
Solution Approach 2:
The patent uses printed copies of alignment features (positive features printed on substrate surfaces) instead of the original expensive silicon etch pit structures. These printed features replicate the alignment function at a fraction of the cost, using standard printing processes rather than specialized semiconductor fabrication.
2Manufacturing precision
If ball-and-pit alignment technique is used, then alignment is achieved, but assembly complexity increases
Solution Approach 1:
The patent extracts the alignment function from the complex ball-and-pit system and implements it through simple printed positive features directly on the substrate surfaces. This eliminates the need for separate alignment balls and pits, reducing the number of components and simplifying the assembly process.
Solution Approach 2:
The patent merges the alignment function with the substrate surface itself by printing features directly on the substrate. Instead of requiring separate alignment components (balls and pits), the alignment features are integrated into the substrate structure, reducing assembly complexity.
3Manufacturing precision
If ball-and-pit alignment technique is used, then alignment is achieved, but substrate compatibility is limited
Solution Approach 1:
The patent creates a universal alignment solution using printed positive features that can be applied to multiple substrate types (organic, ceramic, silicon) rather than being limited to silicon substrates with etch pits. The printing process is substrate-agnostic, enabling broad compatibility across different material platforms.
Solution Approach 2:
The patent changes the material parameter of the substrate from restricted silicon to multiple materials (organic, ceramic, silicon) by using a printing process that is not material-specific. This allows the same alignment technique to work across different substrate types, improving versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly complexity and costs by eliminating the need for external locking mechanisms and adhesive, allowing for precise alignment and compatibility with various substrates, thereby lowering the overall cost and improving performance of MCMs.
Implementation Method 1
the shape of the given positive feature may be defined by reflowing a material in the given positive feature
Implementation Method 2
the elastic modulus may be increased from the initial value using thermal or optical curing
Implementation Method 3
the elastic modulus may be increased from the initial value using thermal or optical curing
Data Source
AI summary
A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features.