Substrate Support Auto-Correction Using Imaging and Gas Flow
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Solution Overview
Problem
In semiconductor manufacturing, substrates often become misaligned during processing due to factors like gas flow, pressure, and temperature variations, leading to non-uniformity and potential contamination, which necessitates a system for monitoring and auto-correction of substrate positioning.
Innovation Solution
A processing system with a substrate support and imaging device that detects misalignment, provides gas flow adjustments to correct the substrate position, and stops gas flow once the substrate is centered, ensuring precise alignment and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If substrates are firmly attached to substrate support to prevent movement during processing, then substrate stability is improved, but substrate misalignment due to thermal shock and warping cannot be corrected
Solution Approach 1:
The system performs preliminary detection of substrate alignment using an imaging device before processing begins. The controller identifies misalignment caused by thermal shock and warping, then activates gas flow through flow conduits to push the substrate back into proper alignment with the processing chamber center, preventing alignment issues during processing.
Solution Approach 2:
The system uses an imaging device to continuously monitor substrate position and provides feedback to the controller. When misalignment is detected, the controller adjusts gas flow through flow conduits to correct the substrate position, creating a closed-loop feedback system that maintains precise alignment throughout processing.
2Device complexity
If substrate support structures are improperly aligned, then device complexity is reduced, but substrate contamination and misalignment increase
Solution Approach 1:
The imaging device continuously monitors substrate position and provides feedback to the controller. When misalignment that could lead to contamination is detected, the controller activates gas flow through flow conduits to reposition the substrate, preventing contact with contaminated surfaces and maintaining substrate cleanliness throughout processing.
Solution Approach 2:
The system uses gas flow through flow conduits as a pneumatic mechanism to adjust substrate position. Gas is directed through conduits located at the substrate support to apply controlled pressure that pushes the substrate back into proper alignment, preventing contamination without complex mechanical adjustment mechanisms.
3Manufacturing precision
If imaging device is added to monitor substrate position, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system replaces complex mechanical alignment adjustment mechanisms with an imaging-based detection system and pneumatic gas flow correction. The imaging device provides precise optical measurement of substrate position, while gas flow through conduits provides contactless alignment correction, eliminating the need for complex mechanical adjustment systems.
4Manufacturing precision
If gas flow is used to correct substrate misalignment, then manufacturing precision is improved, but energy consumption increases
Solution Approach 1:
The system applies gas flow only partially and only when misalignment is detected by the imaging device. The controller activates flow conduits selectively to correct specific alignment issues, rather than maintaining continuous gas flow, thereby minimizing energy consumption while achieving precise alignment correction when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively auto-corrects substrate misalignment, maintaining uniform processing and preventing contamination, thereby enhancing the quality and reliability of semiconductor manufacturing.
Implementation Method 1
An imaging device is coupled to the process chamber and configured to monitor a position of a substrate when loaded in the pocket of the substrate support
Implementation Method 2
A plurality of flow conduits extend between a top surface of the pocket and a bottom surface of the substrate support
Data Source
AI summary
Embodiments described herein relate semiconductor manufacturing and processing. More particularly, a processing systems for auto correcting misalignments of substrates in process chambers is provided. The processing system includes a process chamber having a substrate support disposed within a chamber volume of the process chamber. The substrate support includes a pocket for receiving a substrate, and a plurality of flow conduits extending between a top surface of the pocket and a bottom surface of the substrate support. An imaging device is coupled to the process chamber and configured to monitor a position of a substrate when loaded in the pocket of the substrate support.