Real-time Substrate Alignment via Pattern Recognition

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Solution Overview

Problem

The existing bonding processes for substrates, such as in the semiconductor industry, face inaccuracies due to inconsistent substrate sizes and lack of real-time positional correction, relying on mechanical alignment which is sensitive to material variations.

Innovation Solution

An apparatus and method for real-time alignment and lamination of substrates using a pattern recognition system to monitor and adjust the relative positions of substrates before full bonding, incorporating a first and second substrate holder, a pattern recognition system, and a positioning mechanism to ensure precise alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical alignment is used to align substrates, then the alignment process is simple and fast, but the bonding accuracy deteriorates due to substrate size variations

Engineering Contradiction:

Improvealignment speedVSAvoidbonding accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by performing mechanical alignment first to quickly position substrates, then subsequently performing real-time optical alignment to correct positional errors. This two-stage approach allows the system to benefit from both the speed of mechanical alignment and the precision of optical correction, resolving the contradiction between alignment speed and bonding accuracy

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the purely mechanical alignment system with a hybrid system that incorporates optical sensing and feedback control. The pattern recognition system detects substrate positions and feeds this information to a controller that adjusts substrate positions, substituting mechanical precision requirements with optical measurement and active control

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If mechanical stoppers are used to guide substrate positions, then the alignment process is straightforward, but placement accuracy deteriorates due to material variations

Engineering Contradiction:

Improvealignment simplicityVSAvoidplacement accuracy

Core Design Contradiction:

Ease of operationVSMeasurement precision

Solution Approach 1:

The patent implements feedback control by using the pattern recognition system to continuously monitor substrate positions and feeding this information back to the positioning mechanism. This closed-loop system automatically compensates for placement errors caused by material variations, maintaining high placement accuracy while keeping the operation simple through automated correction

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent introduces an intermediary optical measurement system between the mechanical positioning components and the substrates. The pattern recognition system acts as an intermediary that translates physical substrate positions into measurable data, enabling precise measurement without direct mechanical contact that would compromise accuracy

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If real-time pattern recognition system is added to correct positional errors, then bonding accuracy is improved, but device complexity increases

Engineering Contradiction:

Improvebonding accuracyVSAvoidsystem complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing the pattern recognition system to serve multiple functions: it identifies substrate positions, measures alignment errors, and provides feedback for correction. This multi-functional approach consolidates what could be separate complex systems into a single integrated solution, improving bonding accuracy while limiting the increase in overall device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Productivity

If mechanical alignment features are used, then the lamination process is fast, but alignment precision deteriorates due to substrate size inconsistencies

Engineering Contradiction:

Improvelamination speedVSAvoidalignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent uses preliminary mechanical alignment to quickly establish approximate substrate positions, maintaining high lamination speed. Then, real-time optical measurement and feedback control are applied to correct alignment precision errors, achieving both fast processing and high precision without sacrificing either attribute

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8821659B2Apparatus and method for real-time alignment and lamination of substrates

Publication Date: 2014.09.02 ASMPT SINGAPORE PTE LTD

AI summary

Real-time alignment of substrates is conducted by way of placing a first substrate together with a second substrate located over the first substrate in a fixed relative position onto a first substrate holder. The first substrate holder is operative to support the first substrate. A second substrate holder is operative to contact and control the position of the second substrate relative to the first substrate. A pattern recognition system is operative to view reference marks on the first and second substrates for determining their relative alignment, and a positioning mechanism coupled to the first substrate holder and/or the second substrate holder will align the first substrate relative to the second substrate based on their relative alignment as determined by the pattern recognition system. Thereafter, the substrates are fully laminated to secure them to each other.