Automated Substrate Alignment via Through-Beam Sensor Feedback
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Solution Overview
Problem
Manual alignment methods in substrate processing apparatuses are subjective, time-consuming, and lack repeatability, leading to inaccuracies and increased downtime, especially when dealing with the precise placement of substrates in tightly arranged fabrication facilities.
Innovation Solution
An automated substrate processing apparatus with a self-teaching system using through-beam sensors and positional encoders to accurately determine and adjust the alignment of substrates, eliminating the need for specialized targets or sensors, and ensuring precise positioning through geometric modeling and feedback mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual alignment methods are used, then alignment can be performed with simple equipment, but alignment accuracy and repeatability deteriorate due to subjectivity
Solution Approach 1:
The patent replaces manual mechanical alignment with an automated optical sensing system. Through-beam sensors detect substrate positions and encoders measure transport apparatus movements, eliminating subjective human judgment. The control system processes this data to automatically calculate and apply alignment corrections, substituting mechanical manual operations with automated sensor-based measurement and control.
Solution Approach 2:
The system performs self-alignment by automatically detecting its own geometric parameters and correcting deviations. The transport control system uses encoder data and sensor measurements to self-diagnose alignment issues and self-correct by adjusting transport trajectories, eliminating the need for external technician intervention and specialized alignment equipment.
2Productivity
If manual alignment methods are used, then equipment setup can be performed with basic tools, but production downtime increases due to time-consuming procedures
Solution Approach 1:
The system performs preliminary alignment measurements and calculations automatically during equipment setup or after component replacement. By pre-determining the exact alignment corrections needed through automated sensor measurements and encoder data analysis, the system eliminates time-consuming manual trial-and-adjustment procedures, reducing equipment idle time and maximizing substrate throughput.
3Measurement precision
If specialized targets or sensors are used for alignment, then measurement precision improves, but device complexity and cost increase
Solution Approach 1:
The patent makes existing transport apparatus components serve dual functions: the transport mechanism not only moves substrates but also precisely positions them for alignment measurement. The through-beam sensors and encoders, while part of the standard transport system, simultaneously perform both transport control and alignment measurement functions, eliminating the need for separate specialized alignment equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated system significantly improves alignment accuracy and repeatability, reduces downtime, and enables precise substrate placement, enhancing the efficiency and reliability of substrate processing in semiconductor and display manufacturing.
Implementation Method 1
a through-beam sensor produces a beam of light and detects interruption of the beam
Implementation Method 2
an encoder measures a position of the transport apparatus by detecting changes in a position of light
Data Source
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AI summary
A substrate processing apparatus is provided with a substrate transport apparatus. The transport apparatus is used for automating alignment of the processing apparatus. In one aspect, a through-beam sensor on the transport apparatus is used to level parts of the processing apparatus. In another aspect, a through-beam sensor on the transport apparatus is used to determine the locations and angular orientations of substrate stations within a plane. In another aspect, the transport apparatus teaches itself the accurate location of a substrate aligner by repeatedly placing the substrate on the aligner, recording positional data, constructing a cost function, and determining the location of the aligner by minimizing the cost function using a numerical technique.