Substrate Alignment via Transfer Unit Offset for Sensor Range Limits

Solution Overview

Problem

Substrate misalignment exceeding the accommodation range of a centering buffer unit leads to process defects and reduced alignment accuracy during semiconductor manufacturing, requiring manual intervention and increased alignment time.

Innovation Solution

A substrate treating apparatus and method that includes a transfer unit with location sensors to measure and correct substrate misalignment, temporarily offsetting the transfer unit's hand by a preset interval to align the substrate within the sensor reading range, using a substrate alignment unit with alignment pins to ensure precise positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the accommodation range of the centering buffer unit is increased to handle substrates exceeding the sensor reading range, then the substrate alignment capability is improved, but the device complexity and alignment time increase

Engineering Contradiction:

Improvesubstrate alignment capabilityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The alignment process is segmented into two distinct stages: (1) a first alignment operation using the centering buffer unit for substrates within its accommodation range, and (2) a second alignment operation using the substrate alignment unit for substrates exceeding the centering buffer unit's range. This segmentation allows each unit to be optimized for its specific function, resolving the contradiction by handling different substrate cases differently rather than requiring one complex system to handle all cases.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The centering buffer unit performs a preliminary alignment operation to bring the substrate within the sensor reading range before the main alignment operation is performed by the substrate alignment unit. This preliminary action enables the subsequent precise alignment to be performed efficiently, avoiding the need for the substrate alignment unit to handle gross misalignments directly.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If the accommodation range of the centering buffer unit is increased to handle substrates exceeding the sensor reading range, then the substrate alignment capability is improved, but the alignment time increases

Engineering Contradiction:

Improvesubstrate alignment capabilityVSAvoidalignment time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The alignment process is segmented into two distinct stages: (1) a first alignment operation using the centering buffer unit for substrates within its accommodation range, and (2) a second alignment operation using the substrate alignment unit for substrates exceeding the centering buffer unit's range. This segmentation allows each unit to be optimized for its specific function, resolving the contradiction by handling different substrate cases differently rather than requiring one complex system to handle all cases.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The centering buffer unit performs a preliminary alignment operation to bring the substrate within the sensor reading range before the main alignment operation is performed by the substrate alignment unit. This preliminary action enables the subsequent precise alignment to be performed efficiently, avoiding the need for the substrate alignment unit to handle gross misalignments directly.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If manual intervention is used to move substrates to a central location when misalignment exceeds the centering buffer unit range, then the substrate alignment capability is improved, but the productivity decreases

Engineering Contradiction:

Improvesubstrate alignment capabilityVSAvoidproductivity

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The substrate alignment unit automatically performs the alignment function that would otherwise require manual intervention. The control unit coordinates the transfer unit and substrate alignment unit to autonomously handle substrates exceeding the centering buffer unit's range, eliminating the need for operator intervention and maintaining high productivity while expanding alignment capability.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS11626309B2Substrate treating apparatus and substrate treating method

Publication Date: 2023.04.11 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.