Substrate Alignment Using Distance Sensors for Wedge Error Compensation
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Solution Overview
Problem
Current methods for wedge error compensation in substrate alignment are inefficient, particularly in bonding processes, and are ineffective for non-transparent substrates as they require direct measurement of electromagnetic radiation, which is often not possible.
Innovation Solution
A device and method utilizing multiple distance sensors, including inner and outer sensors arranged in pairs, to measure distances between substrates and substrate holders, allowing for efficient wedge error compensation without direct electromagnetic radiation measurement, using interferometry and adjustable sensor positions for accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If direct electromagnetic radiation measurement is used for wedge error compensation, then measurement precision is improved, but it cannot be applied to non-transparent substrates
Solution Approach 1:
The patent introduces substrate holder surfaces as intermediary measurement targets. Instead of measuring the substrate directly (which fails for non-transparent materials), the system measures the distance between distance sensors and the substrate holder surfaces, which are always accessible and measurable. This intermediary approach allows wedge error compensation for both transparent and non-transparent substrates.
Solution Approach 2:
The patent replaces optical measurement methods (electromagnetic radiation) with mechanical distance measurement using distance sensors. This substitution enables measurement of non-transparent substrates by measuring the mechanical distance to the substrate holder surface rather than relying on optical penetration through the substrate.
2Manufacturing precision
If conventional wedge error compensation methods are used, then alignment accuracy is improved, but processing speed deteriorates
Solution Approach 1:
The patent performs preliminary measurement of distances between distance sensors and substrate holder surfaces before the actual substrate processing. This preliminary action allows the system to pre-calculate compensation values and rapidly apply them during substrate processing, improving throughput while maintaining alignment accuracy.
Solution Approach 2:
The system uses the substrate holder surfaces themselves as the measurement reference, eliminating the need for separate reference standards or complex measurement setups. The substrate holder serves its dual function of holding the substrate and providing the measurement reference surface, streamlining the process.
3Device complexity
If single position measurement is used, then device complexity is reduced, but wedge error compensation capability is lost
Solution Approach 1:
The patent places multiple distance sensors at different positions on the substrate holder. Each sensor measures the local distance to the substrate holder surface at its specific location. This distributed measurement approach enables detection of wedge errors across different regions of the substrate holder, providing the capability to compensate for non-parallelism while keeping each individual sensor simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate wedge error compensation for both transparent and non-transparent substrates, improving processing speed and efficiency in substrate alignment and bonding processes.
Implementation Method 1
The measurement takes place through one of the two transparent substrates. The central idea behind WO2012028166A1 consists in compensating for the wedge error between the substrate surfaces on which the embossing structures are located.
Implementation Method 2
the first substrate holder comprises at least three outer distance sensors for measuring second distances to the second substrate holder surface of the second substrate holder
Data Source
AI summary
The invention relates to a device and a method for the alignment of substrates.


