Substrate Angle Alignment Device for Continuous Wafer Transfer
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Solution Overview
Problem
The existing substrate angle alignment device and method are inefficient as they require a standby period between processing sets of wafers, leading to unproductive time and empty state transfers, as they can only handle one set of wafers at a time, limiting operation and transfer efficiency.
Innovation Solution
A substrate angle alignment device with multiple holding sections, rotation, and up-down units that allow simultaneous alignment and transfer of multiple substrates, enabling continuous operation by exchanging unaligned and aligned substrates, reducing standby time and empty transfers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single set of wafers is processed at a time in the substrate angle alignment device, then the alignment precision is maintained, but the productivity is reduced due to standby periods between processing sets
Solution Approach 1:
The substrate angle alignment device is divided into multiple independent processing sections (first processing section and second processing section), each capable of processing wafers independently. This segmentation allows simultaneous processing of multiple wafer sets without interfering with alignment precision in each section.
Solution Approach 2:
By providing multiple processing sections that can operate simultaneously and independently, the system eliminates standby periods between processing sets. While one section is completing alignment, another section can be loading or preparing the next set of wafers, ensuring continuous useful action and improving productivity.
2Manufacturing precision
If the wafer transfer/loading unit waits for angle alignment completion before carrying out wafers, then alignment accuracy is ensured, but loss of time occurs due to unproductive standby
Solution Approach 1:
The wafer transfer/loading unit performs preliminary actions by carrying in the next set of wafers while the current set is being processed. This preliminary action ensures that when alignment is complete, the transfer unit is already positioned and ready, eliminating standby time without compromising alignment accuracy.
Solution Approach 2:
The system dynamically coordinates the operations of multiple processing sections with the transfer unit. The transfer unit can dynamically switch between serving different processing sections, optimizing the timing of carry-in and carry-out operations to minimize idle time while maintaining precision requirements.
3Productivity
If multiple sets of wafers are processed simultaneously in the same processing section, then productivity increases, but manufacturing precision deteriorates due to interference between wafers
Solution Approach 1:
Multiple processing sections are provided as separate, independent units. Each section processes one set of wafers at a time, preventing interference between wafers from different sets. This segmentation maintains manufacturing precision while the overall system productivity increases due to parallel processing capability.
4Ease of operation
If the vertical spacing between scooping pins is reduced to scoop only specific wafers, then ease of operation improves for selective wafer handling, but device complexity increases due to precise positioning requirements
Solution Approach 1:
The scooping mechanism is divided into multiple independent scooping pins, each capable of independent vertical movement. This segmentation allows selective scooping of specific wafers (e.g., only the lowermost wafer) by controlling individual pin movements, improving ease of operation while managing complexity through modular design.
Solution Approach 2:
The scooping pins are designed with dynamic, independent vertical movement capability rather than fixed positioning. This allows the system to adaptively select which wafers to scoop based on processing requirements, improving operational flexibility while the modular dynamic control manages the complexity through standardized actuation mechanisms.
Data Source
AI summary
A substrate angle alignment device includes a plurality of holding sections which hold a plurality of substrates, respectively in such a manner that the plurality of substrates are placed to be oriented horizontally and arranged vertically, a first up-down unit including a plurality of first support sections, and a second up-down unit including a plurality of second support sections. The device repeats a series of angle alignment operations in which the plurality of holding sections are rotated together to perform angle alignment of selected one of the plurality of substrates, and the first support section corresponding to the aligned substrate is moved up to lift up the substrate with the first support section. The device moves the plurality of second support sections up together to lift up the plurality of aligned substrates supported on the plurality of first support sections, with the plurality of second support sections, respectively.