Circuitized Substrate Angular Reflector Optical Pathway
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Solution Overview
Problem
Current circuitized substrates face challenges in integrating internal optical pathways effectively, leading to increased costs and limited versatility in optical signal transmission and reception, particularly in high-density interconnection applications.
Innovation Solution
A method involving the formation of angular reflectors and optical cores within a multilayered substrate structure, utilizing conventional PCB processes to create optical pathways that allow for efficient optical signal transmission and reflection, enabling cost-effective production of substrates suitable for various applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional PCB processes are used to integrate internal optical pathways, then production costs are reduced, but optical signal transmission capability is limited
Solution Approach 1:
The patent combines electrical and optical interconnection functions into a single circuitized substrate by integrating optical pathways within the substrate structure itself. The optical core is embedded between cladding layers that are part of the substrate stack, allowing both electrical signals (through conductive traces) and optical signals (through the optical core) to coexist and be routed independently within the same substrate architecture.
Solution Approach 2:
The circuitized substrate is designed to perform multiple functions simultaneously: it provides both electrical interconnection through conventional conductive traces and optical interconnection through the embedded optical pathway. The substrate structure serves as both the mechanical support for electrical components and the waveguide for optical signals, eliminating the need for separate optical interconnection structures.
2Adaptability or versatility
If optical pathways are integrated into circuitized substrates, then optical signal transmission is enabled, but structural complexity increases
Solution Approach 1:
The substrate structure is segmented into distinct functional layers: a first cladding layer, an optical core, and a second cladding layer. This segmentation allows each layer to be optimized for its specific function while maintaining a relatively simple overall structure. The optical pathway is created by forming the optical core between the two cladding layers, which can be done using conventional PCB lamination processes.
Solution Approach 2:
The optical pathway is nested within the existing substrate structure. The optical core is embedded between the first and second cladding layers, which themselves are integrated into the multi-layer substrate stack. This nesting approach allows the optical pathway to be incorporated without adding significant external complexity, as the optical components are contained within the substrate's existing layer structure.
3Productivity
If internal optical pathways are formed in circuitized substrates, then high-density interconnections are achieved, but manufacturing precision requirements increase
Solution Approach 1:
The optical pathway dimensions and positioning are controlled by adjusting manufacturing parameters such as the thickness of the cladding layers and the size of the optical core. By optimizing these parameters, the patent achieves precise optical pathway formation using conventional PCB manufacturing processes. The refractive index contrast between the optical core and cladding layers is also optimized to enhance optical confinement and reduce sensitivity to manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the integration of optical pathways within circuitized substrates, reducing production costs and expanding their applicability across different product sizes and end-use scenarios, while providing reliable optical signal transmission and immunity to electromagnetic interference.
Implementation Method 1
forming an opening within the covering layer and second cladding layer relative to the angular reflector such that optical signals passing through the optical core will be reflected off the angular reflector and pass through this opening
Data Source
AI summary
A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.