Substrate Annealing Chamber With Directed Cooling Gas Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device manufacturing, the annealing process often results in non-uniform heating of substrates due to inadequate temperature distribution, leading to uneven processing of target films.
Innovation Solution
A substrate processing apparatus is designed with an electromagnetic wave generator and a gas supplier that adjusts the direction of cooling gas flow to ensure uniform heating, using a configuration of nozzles and an arc-shaped plate to direct gases tangentially, allowing for precise temperature control and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating structure such as a heater is used to heat the substrate in a process chamber, then the substrate can be heated for annealing, but the substrate cannot be uniformly heated resulting in non-uniform processing of the target film
Solution Approach 1:
The patent replaces the conventional mechanical heater system with an electromagnetic wave generator that uses electromagnetic radiation (microwaves) to heat the substrate. This substitution allows for more uniform energy distribution across the substrate surface, eliminating the non-uniform heating problems associated with contact or proximity heaters while maintaining effective annealing temperatures
Solution Approach 2:
The heating structure is designed to serve multiple functions: it provides uniform heating across the substrate surface, maintains precise temperature control, and works in conjunction with the gas supplier system to enable both heating and cooling operations. The electromagnetic wave generator can be adjusted to treat different substrate sizes and configurations, making the system universally applicable
2Temperature
If cooling gas is supplied to control substrate temperature, then temperature control can be achieved, but the direction of cooling gas supply must be precisely adjusted to maintain temperature uniformity
Solution Approach 1:
The gas supplier system incorporates adjustable nozzle directions that can be dynamically modified during operation. The cooling gas supply direction is made adjustable rather than fixed, allowing the system to adapt to different substrate positions and heating patterns. This dynamic adjustment capability enables temperature uniformity to be maintained without requiring complex mechanical intervention
Solution Approach 2:
The system uses temperature detection to monitor substrate temperature distribution and provides feedback control to the gas supplier. Based on the detected temperature patterns, the cooling gas supply direction and flow rate are automatically adjusted to correct any non-uniformities, creating a closed-loop control system that maintains temperature uniformity without manual intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity on the substrate surface, improves processing reproducibility, and reduces the influence of electromagnetic fields, enabling efficient and uniform modification of films during the annealing process.
Implementation Method 1
an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber
Implementation Method 2
a gas supplier through which a cooling gas is supplied to the substrate by adjusting a direction of supplying the cooling gas
Data Source
AI summary
There is provided a technique that includes: a process chamber in which a substrate is processed; an electromagnetic wave generator configured to supply an electromagnetic wave into the process chamber; and a gas supplier through which a cooling gas is supplied to the substrate by adjusting a direction of supplying the cooling gas.