Semiconductor Package Antenna Integration for Compact Protected Coupling
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large size, leading to suboptimal performance.
Innovation Solution
A semiconductor device design that includes a substrate with a dielectric structure and conductive structure, coupled with electronic components and antenna elements, where the antenna elements are positioned outside the electronic component footprint and connected through the substrate conductive structure, and encapsulated with a protective layer to provide electrical coupling and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is high and reliability is decreased
Solution Approach 1:
The package structure is divided into distinct functional layers including substrate, die attach layer, encapsulant, and antenna elements. Each layer is manufactured and processed separately before being assembled into the final package, allowing for specialized manufacturing processes for each component while maintaining overall reliability.
Solution Approach 2:
The patent transitions from planar 2D package layouts to three-dimensional vertical stacking arrangements. Multiple components including antennas, electronic components, and interconnect structures are stacked in vertical layers, reducing the package footprint while improving signal integrity and reliability through optimized spatial relationships.
2Productivity
If conventional package designs are used, then manufacturing processes are established, but package size is large and performance is low
Solution Approach 1:
The patent implements nested arrangements where antenna elements are positioned within or adjacent to the electronic component footprint. The antenna structures are integrated into the package volume rather than occupying separate external space, effectively nesting multiple functional elements within the same spatial envelope to reduce overall package area while maintaining performance.
Solution Approach 2:
The package design utilizes vertical stacking in the Z-dimension to accommodate multiple components. Electronic components, antennas, and interconnect structures are arranged in multiple layers vertically, transforming a 2D layout problem into a 3D space utilization solution that reduces the planar footprint while maintaining or enhancing device performance.
3Area of stationary object
If antenna elements are integrated within the package, then size is reduced, but electrical coupling and environmental protection become challenging
Solution Approach 1:
The patent introduces specialized interconnect structures and dielectric layers as intermediary elements between antenna elements and electronic components. These intermediary structures provide controlled impedance pathways, electromagnetic shielding, and environmental isolation, ensuring reliable electrical coupling and protection while maintaining compact integration of antenna elements within the package footprint.
Solution Approach 2:
The encapsulant and dielectric structures serve multiple functions simultaneously: they provide mechanical support, environmental protection, electrical insulation, and electromagnetic shielding. This multi-functionality allows compact integration of antenna elements while maintaining reliability through a single comprehensive protective structure rather than requiring separate dedicated components for each function.
Data Source
AI summary
A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.