Semiconductor Substrate Antenna Integration via Through Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing cost and size of semiconductor devices increase due to the use of expensive chip antennas and the need for additional components like matching components, which hinder miniaturization.
Innovation Solution
A semiconductor device design where a passive circuit is placed on the opposite side of the semiconductor substrate and connected via a through electrode, eliminating the need for a separate substrate and allowing for miniaturization and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip antenna is used as a passive circuit, then the device can achieve wireless communication function, but the manufacturing cost increases and the device cannot be miniaturized
Solution Approach 1:
The patent replaces the expensive chip antenna with a printed antenna pattern formed by conductive wiring on the substrate. This copying approach uses simple trace routing to replicate the antenna function, significantly reducing manufacturing cost while maintaining wireless communication capability
Solution Approach 2:
The patent extracts the antenna function from the chip antenna component and integrates it directly into the substrate through printed wiring patterns. This eliminates the need for separate chip antenna components and their associated mounting structures, reducing both cost and device size
2Reliability
If a chip antenna is used, then wireless communication is enabled, but additional matching components are required which increase substrate area and cost
Solution Approach 1:
The patent merges the antenna pattern and impedance matching circuit into a single integrated printed wiring structure on the substrate. The conductive traces simultaneously serve as both the radiating element and the impedance transformation network, eliminating the need for separate matching components and reducing substrate area
Solution Approach 2:
The printed wiring pattern performs multiple functions: it acts as the antenna radiating element, provides impedance matching, and serves as the connection interface. This multi-functionality consolidates what would traditionally require separate components into a single integrated structure
3Area of moving object
If CPU and RF device are integrated in one chip, then chip area is reduced, but the chip antenna or antenna pattern still requires additional space preventing sufficient miniaturization
Solution Approach 1:
The patent transitions the antenna from a planar chip-mounted component to a substrate-level printed pattern. By moving the antenna implementation to the substrate dimension rather than the chip surface, the antenna can be formed using the existing substrate wiring layers without consuming additional chip area
Data Source
AI summary
A semiconductor chip 11 comprising an element formation layer which is formed on a first main surface 35A of a semiconductor substrate 35 and has a semiconductor element, through electrodes 15, 16 which are electrically connected to the semiconductor element and extend through the semiconductor chip 11, and a patch antenna 33 formed on the side of a second main surface 35B of the semiconductor substrate 35 are disposed, and the patch antenna 33 is electrically connected to the through electrode 15 electrically connected to a line for power feeding of the semiconductor element.