Component Substrate Apertures for Solder Joint Gas Venting
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Solution Overview
Problem
The formation of gas within solder joints during the reflow soldering process can lead to imperfect and non-uniform connections, affecting the thermal and electrical performance of electronic components, particularly in devices like photo-epilation devices with high-intensity light emitting diodes, where trapped gas reduces light intensity and increases thermal risk.
Innovation Solution
Creating apertures through the component substrate in the interspace between electronic components allows for the easy outgassing of volatile solvents during soldering, preventing gas capture in the solder joint and ensuring a uniform connection by forming these apertures during the manufacturing process, such as lithographic deposition or dicing, without damaging the base substrate like a printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reflow soldering process is used to connect electronic components to a substrate, then permanent electrical connections are created, but gas trapped within the solder joint causes imperfect and non-uniform connections
Solution Approach 1:
The patent extracts the harmful gas from the solder joint by providing an aperture in the component substrate that allows gas to escape during the reflow soldering process. The aperture serves as an extraction path for volatile solvents and gases, preventing them from being trapped in the solder joint and causing defects.
Solution Approach 2:
The component substrate is designed with an aperture (a form of porosity) that allows gas to pass through during soldering. This controlled porosity enables gas escape while maintaining the structural integrity of the substrate, resolving the contradiction between creating strong solder joints and allowing gas venting.
2Manufacturing precision
If apertures are formed in the base substrate to allow gas outgassing, then solder joint uniformity is improved, but the base substrate (e.g., PCB) may be damaged
Solution Approach 1:
The patent segments the gas escape function from the base substrate by placing the aperture in the component substrate instead. This segmentation allows the gas venting function to be performed by a separate component (the component substrate) that is designed to accommodate apertures without compromising the integrity of the base substrate.
Solution Approach 2:
The component substrate acts as an intermediary between the solder paste and the base substrate. By placing the aperture in the component substrate, it serves as a mediator that allows gas to escape from the solder joint without requiring direct modification of the base substrate, thus protecting the PCB from damage.
3Object-generated harmful factors
If apertures are formed in the component substrate, then gas can outgas during soldering, but the alignment of electronic components may be hindered
Solution Approach 1:
The aperture is positioned in a specific location on the component substrate (in the interspace between electronic components) where it provides gas escape functionality without interfering with the alignment features or the placement of electronic components. This localized placement resolves the contradiction between gas outgassing and component alignment.
4Strength
If solder paste is applied between surfaces to temporarily adhere them, then permanent connections are achieved after heating, but volatile solvents outgas and cause gas pockets
Solution Approach 1:
The aperture provides an extraction path for volatile solvents and gases that are released during the heating process. By allowing these gases to escape through the aperture, the patent prevents gas pocket formation that would otherwise compromise the strength and quality of the solder joint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity and efficiency of solder joints, maintaining consistent light intensity and heat conduction across arrays of light emitting diodes, reducing thermal and electrical issues in personal care devices like photo-epilation devices.
Implementation Method 1
The assembly (or the solder paste) is then heated causing the solder to melt, thereby creating a permanent electrical connection between the surfaces to be connected
Implementation Method 2
During the reflow soldering process, volatile solvents in the solder paste are caused to outgas
Data Source
AI summary
There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The at least one aperture is formed in an interspace between the at least two electronic components. The component substrate is coupled to the base substrate using a solder joint. Each of the at least two electronic components may comprise a light emitting diode element. A method of manufacturing an apparatus is also disclosed.