Substrate Transport Arm Droop Compensation for Precise Wafer Transfer
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Solution Overview
Problem
In semiconductor substrate processing, existing robotic transport apparatuses face challenges in minimizing the vertical displacement of the end effector as it extends and retracts through smaller transport openings, leading to mechanical design constraints that affect static and dynamic stiffness, resulting in high costs and inadequate precision.
Innovation Solution
The implementation of a substrate transport arm droop mapping apparatus that compensates for arm droop during operation by mapping the droop distance and adjusting the transport arm's position to maintain alignment with a predetermined reference plane, ensuring precise positioning and reduced vertical displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transport opening size is reduced to increase throughput, then productivity is improved, but the allowable vertical displacement of the end effector is constrained, worsening manufacturing precision
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the arm link geometries and material properties to maximize static and dynamic stiffness. This allows the system to maintain precise vertical positioning (minimizing displacement) while operating through smaller transport openings, thus resolving the contradiction between increased throughput and maintained precision.
2Manufacturing precision
If high-stiffness materials and optimized arm link geometries are used to minimize vertical displacement, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The system dynamically adjusts arm link geometries and material parameters to achieve maximum stiffness, minimizing vertical displacement without requiring permanently complex mechanical designs. This parameter optimization approach reduces device complexity while maintaining precision.
3Manufacturing precision
If the end effector is constrained to minimize vertical displacement through smaller openings, then manufacturing precision is improved, but the time required for transport operations increases, worsening productivity
Solution Approach 1:
The patent employs dynamic adjustment of arm link geometries and material properties to maximize stiffness during transport through small openings. This dynamic optimization enables precise positioning while maintaining fast transport speeds, resolving the contradiction between positioning accuracy and transfer time.
Data Source
AI summary
A substrate transport empiric arm droop mapping apparatus for a substrate transport system of a processing tool, the mapping apparatus including a frame, an interface disposed on the frame forming datum features representative of a substrate transport space in the processing tool defined by the substrate transport system, a substrate transport arm, that is articulated and has a substrate holder, mounted to the frame in a predetermined relation to at least one of the datum features, and a registration system disposed with respect to the substrate transport arm and at least one datum feature so that the registration system registers, in an arm droop distance register, empiric arm droop distance, due to arm droop changes, between a first arm position and a second arm position different than the first arm position and in which the substrate holder is moved in the transport space along at least one axis of motion.